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|  
|  
Process dependent:
Process dependent:
*Dose, <math>Q</math> [µC/cm<sup>2</sup>]
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*Beam current, <math>I</math> [A]
*Beam current [A]: <math>I</math>
*Pattern area, <math>a</math> [cm<sup>2</sup>]
*Pattern area [cm<sup>2</sup>]: <math>a</math>


Process time <math>t = \frac{Q \sdot a}{I}</math>  
Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>  
| Process dependent, including heating/cooling rates
| Process dependent, including heating/cooling rates
|-
|-
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<br clear="all" />
<br clear="all" />


 
=Equipment and Process Pages=
 
{| style="border-collapse: separate; border-spacing: 1; border:none;padding:0"; cellpadding="10"; cellspacing="5"; width="100%";
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
|-
 
|-
|-style="background:silver; color:black"
!width="10%"|
!width="16%"| [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
|-
 
 
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Pattern transfer via ultraviolet (UV) light
|Pattern transfer via deep ultraviolet (DUV) light
|Patterning by electron beam
|Pattern transfer via hot embossing (HE)
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Pattern size range
|
~0.6 µm and up<br>
(resist type, thickness, and pattern dependent)
|
~200 nm and up<br>
(pattern type, shape and pitch dependent)
|
~12 nm - 1 µm<br>
(and larger at high currents)
|
~20 nm and up
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Resist type
|
UV sensitive:
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
DUV sensitive
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|
E-beam sensitive
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
Imprint polymers:
*Topas
*PMMA
*mr-I 7030R
|-
 
|-
|-style="background:LightGrey; color:black"
!Resist thickness range
|
~0.5 µm to 200 µm
|
~50 nm to 2 µm
|
~30 nm to 1 µm
|
~ 100 nm to 2 µm
|-
|-
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Pre-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific_Process_Knowledge/Lithography/UVLithography|Getting started with UV lithography]]'''


|-
'''[[Specific Process Knowledge/Lithography/Resist|Resist]]'''
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
10 s - 3 min pr. wafer using mask aligners<br>
10 min - 5 hours pr. wafer using maskless aligners
|
Process dependent:
*Pattern
*Pattern area
*Dose
 
Throughput is up to 60 wafers/hour
|
Process dependent:
*Dose, Q [µC/cm<sup>2</sup>]
*Beam current, I [A]
*Pattern area, a [cm<sup>2</sup>]
 
time [s] = Q*a/I
|
Process dependent, including heating/cooling rates
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Substrate size
|
*chips down to 3 mm x 3 mm
*50 mm wafers
*100 mm wafers
*150 mm wafers
*200 mm wafers
|
*100 mm wafers
*150 mm wafers
*200 mm wafers
|
We have cassettes fitting:
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size
*1 wafer of 200 mm in size
Only one cassette can be loaded at a time
|
*small samples
*50 mm wafers
*100 mm wafers
*150 mm wafers 
|-
 
|-style="background:WhiteSmoke; color:black"
!'''Allowed materials'''
|
Any standard cleanroom material
|
Any standard cleanroom material
|
Any standard cleanroom material, except:
*Materials that will degas
*Graphene requires special treatment 
|
Any standard cleanroom material
|-
|}
<br clear="all" />
 
=Equipment Pages=
 
{| style="color: black;" width="90%"
| colspan="3" |
|-
| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
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*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]


'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Coating & baking</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]'''
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]


'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]]
 
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


| style="width: 20%"; valign="top"|
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
'''<big><div class="center">Exposure</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]'''
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
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*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]


'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]


'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]


'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]


| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Development</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Development|Manual development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]


| style="width: 20%"; valign="top"|
'''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]'''
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wetbench)]]
*[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]]
 
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8_(Wet_Bench)|Developer: SU8 (Wetbench)]]
'''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam_02|Developer: E-beam 02]]
*[[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual_02|Developer: TMAH Manual 02]]
*[[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
 
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
'''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]


'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Post-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Descum|Descum]]'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
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*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]


'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]'''
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]


'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
'''[[Specific Process Knowledge/Lithography/Strip|Strip]]'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
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=Lithography Tool Package Training=
=Lithography Tool Package Training=


DTU Nanolab offers a Tool Package Training for Lithography (TPT Lithography). You are required to pass this course, in order to get access to the lithography equipment inside the DTU Nanolabs cleanroom facility. The course includes theory on lithographic processes and training videos for equipment operation. The theory part consists of lecture videos followed by quizzes for each section. Once completed successfully, you can do the online training that explains the operation for the specific lithography equipment you want to use in more detail. After completing the online training, you can request hands-on training for the equipment inside the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].  
DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.  
<BR>
 
<BR>
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].  
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here].
 
<BR>
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]
<BR>
 
'''Course Layout'''
 
<BR>
'''TPT lithography course contents'''
# Online lecture videos (theory)
* Online lecture videos
# Quizzes for each section
* Online quiz for each lecture video
# Online training videos (equipment operation)
 
# Individual hands-on training
 
<BR>
''Individual hands-on training can be requested via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].''
<BR>
<BR>
'''Learning objectives'''
'''Learning objectives'''
<BR>
* Coating
* Coating
* Exposure
* Exposure
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* Resist, substrates and pre-treatment
* Resist, substrates and pre-treatment
* Post-lithography steps
* Post-lithography steps
<BR>
 
'''Qualifying Prerequisites'''
 
<BR>
'''Course responsible'''
* Cleanroom safety course at DTU Nanolab
* Admission to the cleanroom must be obtained before the group training session
<BR>
'''Course Responsible'''
* Jens Hindborg Hemmingsen
* Jens Hindborg Hemmingsen
* Thomas Aarøe Anhøj
* Thomas Aarøe Anhøj
<BR>
 
If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk].
If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


<br clear="all" />
<br clear="all" />
<BR>


=Knowledge and Information about Lithography=
=Knowledge and Information about Lithography=
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| style="width: 20%"; valign="top"|
| style="width: 20%"; valign="top"|
'''<big>Manuals</big>'''
'''<big>Manuals</big>'''<br>
''NB: Access to manuals require DTU login''
''NB: Access to manuals require DTU login''
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography"