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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


 
=Lithography=
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
__TOC__
__TOC__


There are four different types of lithography available at DTU Nanolab:
Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]: UV lithography is used for making features as small as about 1 micrometer
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]: DUV lithography is used for features as small as 200 nm
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]: The smallest features can be made in our e-beam writers - about 10 nm
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]: for stamping without irradiation
<br clear="all" />
<br clear="all" />
=Comparing lithography methods at DTU Nanolab=
=Comparing lithography methods at DTU Nanolab=


{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
{| class="wikitable" width="100%"
|-
 
|-
|-
|-style="background:silver; color:black"
! !! [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] !! [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]] !! [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] !! [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
!width="10%"|
!width="16%"| [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
|-
|-
 
! scope=row style="text-align: left;" | Generel description
 
| Pattern transfer via ultraviolet (UV) light || Pattern transfer via deep ultraviolet (DUV) light || Patterning by electron beam || Pattern transfer via hot embossing (HE)
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Pattern size range
!Generel description
| ~1 µm and up<br>(resist type, thickness, and pattern dependent) || ~200 nm and up<br>(pattern type, shape and pitch dependent) || ~10-1000 nm<br>(and larger at high currents) || ~20 nm and up
|Pattern transfer via ultraviolet (UV) light
|Pattern transfer via deep ultraviolet (DUV) light
|Patterning by electron beam
|Pattern transfer via hot embossing (HE)
|-
|-
 
! scope=row style="text-align: left;" | Resist type
 
|  
|-
|-style="background:LightGrey; color:black"
!Pattern size range
|
~0.6 µm and up<br>
(resist type, thickness, and pattern dependent)
|
~200 nm and up<br>
(pattern type, shape and pitch dependent)
|
~12 nm - 1 µm<br>
(and larger at high currents)
|
~20 nm and up
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Resist type
|
UV sensitive:
UV sensitive:
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
|  
DUV sensitive
DUV sensitive:
*JSR KRF M230Y, JSR KRF M35G (positive)
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
*UVN2300-0.8 (negative)
|
|  
E-beam sensitive
E-beam sensitive:
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
|  
Imprint polymers:
Imprint polymers:
*Topas
*Topas
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*mr-I 7030R
*mr-I 7030R
|-
|-
 
! scope=row style="text-align: left;" | Resist thickness range
| ~0.5 µm to 200 µm || ~50 nm to 2 µm || ~30 nm to 1 µm || ~100 nm to 2 µm
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Typical exposure time  
!Resist thickness range
| Mask aligner: 10-180 s per wafer<br>Maskless aligner: 5-60 minutes per wafer  
|
|  
~0.5 µm to 200 µm
|
~50 nm to 2 µm
|
~30 nm to 1 µm
|
~ 100 nm to 2 µm
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
10 s - 3 min pr. wafer using mask aligners<br>
10 min - 5 hours pr. wafer using maskless aligners
|
Process dependent:
Process dependent:
*Pattern
*Pattern
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Throughput is up to 60 wafers/hour
Throughput is up to 60 wafers/hour
|
|  
Process dependent:
Process dependent:
*Dose, Q [µC/cm<sup>2</sup>]
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*Beam current, I [A]
*Beam current [A]: <math>I</math>
*Pattern area, a [cm<sup>2</sup>]
*Pattern area [cm<sup>2</sup>]: <math>a</math>


time [s] = Q*a/I
Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>
|
| Process dependent, including heating/cooling rates
Process dependent, including heating/cooling rates
|-
|-
 
! scope=row style="text-align: left;" | Substrate size
 
|  
|-
|-style="background:LightGrey; color:black"
!Substrate size
|
*chips down to 3 mm x 3 mm
*chips down to 3 mm x 3 mm
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers  
|
|  
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers
|
|  
We have cassettes fitting:
We have cassettes fitting:
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
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*1 wafer of 200 mm in size
*1 wafer of 200 mm in size
Only one cassette can be loaded at a time
Only one cassette can be loaded at a time
|
|  
*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
|-
|-
 
! scope=row style="text-align: left;" | Allowed materials  
|-style="background:WhiteSmoke; color:black"
| Any standard cleanroom material
!'''Allowed materials'''
| Any standard cleanroom material
|
|  
Any standard cleanroom material  
|
Any standard cleanroom material  
|
Any standard cleanroom material, except:
Any standard cleanroom material, except:
*Materials that will degas
*Materials that will degas
*Graphene requires special treatment
*Graphene requires special treatment  
|
| Any standard cleanroom material  
Any standard cleanroom material  
|-
|-
|}
|}
<br clear="all" />
<br clear="all" />


=Equipment Pages=
=Equipment and Process Pages=
{| style="border-collapse: separate; border-spacing: 1; border:none;padding:0"; cellpadding="10"; cellspacing="5"; width="100%";
|-
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Pre-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific_Process_Knowledge/Lithography/UVLithography|Getting started with UV lithography]]'''


{| style="color: black;" width="90%"
'''[[Specific Process Knowledge/Lithography/Resist|Resist]]'''
| colspan="3" |
|-
| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
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*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]


'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Coating & baking</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]'''
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]


'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]]
 
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


| style="width: 20%"; valign="top"|
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
'''<big><div class="center">Exposure</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]'''
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
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*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]


'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]


'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]


'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]


| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Development</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Development|Manual development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]


| style="width: 20%"; valign="top"|
'''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]'''
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wetbench)]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8_(Wet_Bench)|Developer: SU8 (Wetbench)]]
 
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam_02|Developer: E-beam 02]]
'''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual_02|Developer: TMAH Manual 02]]
*[[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
 
'''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]


'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Post-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Descum|Descum]]'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
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*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]


'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]'''
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]


'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
'''[[Specific Process Knowledge/Lithography/Strip|Strip]]'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
Line 237: Line 209:
=Lithography Tool Package Training=
=Lithography Tool Package Training=


DTU Nanolab offers a Tool Package Training for Lithography (TPT Lithography). You are required to pass this course, in order to get access to the lithography equipment inside the DTU Nanolabs cleanroom facility. The course includes theory on lithographic processes and training videos for equipment operation. The theory part consists of lecture videos followed by quizzes for each section. Once completed successfully, you can do the online training that explains the operation for the specific lithography equipment you want to use in more detail. After completing the online training, you can request hands-on training for the equipment inside the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].  
DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.  


The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here].
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].  


'''Course Description'''
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]


# Online lecture videos (theory)
# Quizzes for each section
# Online training videos (equipment operation)
# Hands-on training


''Hands on training can be requested via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].''
'''TPT lithography course contents'''
* Online lecture videos
* Online quiz for each lecture video




'''Learning objectives'''
'''Learning objectives'''
''Learn about the fundamentals of lithography processing in a cleanroom:''
* Coating
* Coating
* Exposure
* Exposure
Line 261: Line 229:




'''Qualifying Prerequisites'''
'''Course responsible'''
 
* Cleanroom safety course at DTU Nanolab
* Admission to the cleanroom must be obtained before the group training session
 
 
'''Course Responsible'''
* Jens Hindborg Hemmingsen
* Jens Hindborg Hemmingsen
* Thomas Aarøe Anhøj <taran@dtu.dk>
* Thomas Aarøe Anhøj
 


If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk].
If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


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<br clear="all" />
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| style="width: 20%"; valign="top"|
| style="width: 20%"; valign="top"|
'''<big>Manuals</big>'''
'''<big>Manuals</big>'''<br>
''NB: Access to manuals require DTU login''
''NB: Access to manuals require DTU login''
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography"