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[[Image:DUV_wafers.jpg|250x250px|right|frame|]]
 
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


=Lithography=
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
__TOC__
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Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]: UV lithography is used for making features as small as about 1 micrometer
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]: DUV lithography is used for features as small as 200 nm
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]: The smallest features can be made in our e-beam writers - about 10 nm
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]: for stamping without irradiation
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=Comparing lithography methods at DTU Danchip=
=Comparing lithography methods at DTU Nanolab=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{| class="wikitable" width="100%"
|-
|-
 
!  !! [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] !! [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]] !! [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] !! [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
|-
|-
|-style="background:silver; color:black"
! scope=row style="text-align: left;" | Generel description
!width="10%"|
| Pattern transfer via ultraviolet (UV) light || Pattern transfer via deep ultraviolet (DUV) light || Patterning by electron beam || Pattern transfer via hot embossing (HE)
!width="16%"| [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] [[Image:section under construction.jpg|70px]]
|-
 
 
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Pattern size range
!Generel description
| ~1 µm and up<br>(resist type, thickness, and pattern dependent) || ~200 nm and up<br>(pattern type, shape and pitch dependent) || ~10-1000 nm<br>(and larger at high currents) || ~20 nm and up
|Pattern transfer via UltraViolet (UV) light
|Pattern transfer via DeepUltraViolet (DUV) light
|Patterning by electron beam
|Pattern transfer via hot embossing(HE)
|Direct writing via IR laser
|-
|-
 
! scope=row style="text-align: left;" | Resist type
 
|
UV sensitive:
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
DUV sensitive:
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|
E-beam sensitive:
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
Imprint polymers:
*Topas
*PMMA
*mr-I 7030R
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Resist thickness range  
!Pattern size range
| ~0.5 µm to 200 µm || ~50 nm to 2 µm || ~30 nm to 1 µm || ~100 nm to 2 µm
|
*~1.25 µm and up
|
*~200 nm and up
|
*~12 nm - 1 µm
|
*~20 nm and up
|
*3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high
*2D spot on opaque substrate: 0.6 µm diameter
|-
|-
! scope=row style="text-align: left;" | Typical exposure time
| Mask aligner: 10-180 s per wafer<br>Maskless aligner: 5-60 minutes per wafer
|
Process dependent:
*Pattern
*Pattern area
*Dose


|-
Throughput is up to 60 wafers/hour
|-style="background:WhiteSmoke; color:black"
|  
!Resist type
Process dependent:
|
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*UV sensitive:
*Beam current [A]: <math>I</math>
**AZ 5214E, AZ 4562, AZ MiR 701 (positive)
*Pattern area [cm<sup>2</sup>]: <math>a</math>
**AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
*DUV sensitive
**JSR KRF M230Y, JSR KRF M35G (positive)
**UVN2300-0.8 (negative)
|
*E-beam sensitive
**AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
|
*Imprint polymers:
**Topas
**PMMA
|
*UV sensitive:
**IP photoresists, SU-8 (3D)
**AZ resists (2D)
|-
|-
|-style="background:LightGrey; color:black"
!Resist thickness range
|
~0.5µm to 20µm
|
~50nm to 2µm
|
~30nm to 0.5 µm
|
~ 100nm to 2µm
|
droplet or coating
|-


Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>
| Process dependent, including heating/cooling rates
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Substrate size
!Typical exposure time
|  
|
*chips down to 3 mm x 3 mm
2s-30s pr. wafer
|
Process depended, depends on pattern, pattern area and dose
|
Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]:    t = Q*A/I
|
Process depended, depends also on heating and cooling temperature rates
|
Process depended, depends on pattern and dose
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Substrate size
|
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
|
*200 mm wafers
|  
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers
|
|  
We have cassettes that fit to
We have cassettes fitting:
*4 small samples (20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
*3 wafers of 100 mm in size
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size  
*1 wafer of 150 mm in size  
Only one cassette can be loaded at time
*1 wafer of 200 mm in size
|
Only one cassette can be loaded at a time
|  
*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers
|
*Cover slides
*50 mm wafers
*100 mm wafers
*IBIDI
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Allowed materials  
!'''Allowed materials'''
| Any standard cleanroom material
|
| Any standard cleanroom material
*Any standard cleanroom material  
|  
|
Any standard cleanroom material, except:
*Any standard cleanroom material  
*Materials that will degas
|
*Graphene requires special treatment
*Any standard cleanroom material  
| Any standard cleanroom material  
|
*Any standard cleanroom material
|
*Any standard cleanroom material  
|-
|-
|}
|}
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=Equipment Pages=
=Equipment and Process Pages=
 
{| style="border-collapse: separate; border-spacing: 1; border:none;padding:0"; cellpadding="10"; cellspacing="5"; width="100%";
|-
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Pre-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific_Process_Knowledge/Lithography/UVLithography|Getting started with UV lithography]]'''


'''[[Specific Process Knowledge/Lithography/Resist|Resist]]'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]


{| style="color: black;" width="90%"
'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]'''
| colspan="3" |
|-
| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]


'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coaters]]</big>'''
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Coating & baking</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
 
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]'''
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
 
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]'''
*[[Specific Process Knowledge/Lithography/Coaters#Spin coater: Manual Labspin|Spin coater: Manual Labspin]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]


'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


| style="width: 20%"|
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]</big>'''
'''<big><div class="center">Exposure</div></big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
<div class="center"><hr width="75%"></div>
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
<br>
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]'''
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
 
<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|JEOL JBX-9500FSZ]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]


'''<big>[[Specific Process Knowledge/Lithography/UVExposure|Deep-UV Exposure]]</big>'''
'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]'''
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]


'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]'''
*[[Specific Process Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer-1 and Developer-2]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific Process Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]


| style="width: 20%"|
'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]'''
'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]
 
'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
 
'''<big>[[Specific_Process_Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]</big>'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
 
'''<big>3D Lithography</big>'''
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]
 
|}


<br clear="all" />
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Development</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Development|Manual development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]


=Knowledge and Information about Lithography=
'''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wetbench)]]


'''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
*[[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]


==Litho Tool Package Training==
'''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]'''
*[[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]


DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.
| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
'''<big><div class="center">Post-lithography</div></big>'''
<div class="center"><hr width="75%"></div>
<br>
'''[[Specific Process Knowledge/Lithography/Descum|Descum]]'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_5|Plasma Asher 5]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]


The course is recommended for all users that intend to perform any lithographic processing in the cleanroom.
'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]'''
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]


'''Schedule:'''  
'''[[Specific Process Knowledge/Lithography/Strip|Strip]]'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_5|Plasma Asher 5]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
|}
<br clear="all" />


The tool package consists of a lecture and a one-day training session in the cleanroom.
=Lithography Tool Package Training=
*Lecture once a month (~3.5 hours). '''NEXT LECTURE: Friday 11th of March 9:15'''
*Training session once a week, max. 6 persons per session (9:00 - 16:00) '''FIRST SESSION: Wednesday 30th of March 9:00'''


'''Location:'''
DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.


Meeting room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].


'''Qualified Prerequisites:'''
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]


* Cleanroom safety course at DTU Danchip
* Wet Chemistry Course at DTU Danchip
'''Preparations:'''


Before the lecture
'''TPT lithography course contents'''
* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
* Online lecture videos
* Optional but recommended: Watch the  training videos (training videos can be found below).
* Online quiz for each lecture video
Before training session
* Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.
* Study the equipment manuals. The manuals are available in LabManager.
* Study the TPT process flows (first print and alignment). The process flows can be found below.


''' Course Responsible:'''


The Lithography Group at DTU Danchip: sign up for the course by emailing to lithography@danchip.dtu.dk.
'''Learning objectives'''
* Coating
* Exposure
* Development
* Resist, substrates and pre-treatment
* Post-lithography steps


''' Learning Objectives:'''


* Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
'''Course responsible'''
* Authorization to use spin coater, mask aligner, and developer at DTU Danchip
* Jens Hindborg Hemmingsen
* Calculate relevant process parameters
* Thomas Aarøe Anhøj
* Analyze and apply your results of lithographic processing
 
''' Sign up for the course'''
* send an email to [mailto:lithography@danchip.dtu.dk lithography@danchip.dtu.dk]


If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


<br clear="all" />
<br clear="all" />


==Knowledge and Litterature==
=Knowledge and Information about Lithography=
{| style="color: black;" width="90%"
{| style="color: black;" width="90%"
| colspan="3" |  
| colspan="3" |  
|-
|-
| style="width: 20%"|
| style="width: 20%"; valign="top"|
'''<big>Literature</big>'''
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[[Media:Litho_Tool_Package_-_1_Introduction_v2_TIGRE_%28TARAN_ed%29.pdf|TPT slides: Introduction]]
*[https://archive.org/details/manualzilla-id-5701639/page/n39/mode/2up Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://www.microchemicals.com/support/troubleshooter.html Lithography Troubleshooter from MicroChemicals]
*[http://www.microchemicals.com/downloads/application_notes.html Application Notes from MicroChemicals]
*[http://www.cnf.cornell.edu/cnf_spietoc.html Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/dokumente/application_notes/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]




'''<big>Spin Coating</big>'''
'''<big>Lecture videos</big>'''
*[[:Media:Litho Tool Package - 2 Spin coating v2 LESJO (TARAN ed).pdf|TPT: Spin Coating]]
*Lithography TPT lecture videos:
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training Video: Automatic Spin Coater]'''
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.057_Manual_Spin_Coater-720p.mp4 Training Video: Manual Spin Coater]'''
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


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<!-- Removed by TARAN 2024-09-27
'''<big>Lithography TPT lecture slides</big>'''<br>
''' NB: Access to slides require login'''
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->


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'''<big>Training videos</big>'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
*[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
'''Playlists on YouTube:'''
*[https://www.youtube.com/playlist?list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner (MLA) training videos]
*[https://www.youtube.com/playlist?list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography equipment training videos (old)]


'''<big>UV Exposure</big>'''
*[[:Media:Litho Tool Package - 3 Exposure v2 TARAN.pdf|TPT slides: UV Exposure]]
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part1_operation-720p.mp4 Training Video: UV Mask Aligner Part I (Operation)]
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part2_aligning-720p.mp4 Training Video: UV Mask Aligner Part II (Alignment)]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure_Dose Information on UV Exposure Dose]


 
| style="width: 20%"; valign="top"|
'''<big>Electron Beam Exposure</big>'''
'''<big>Manuals</big>'''<br>
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ#Getting_started|Training on JEOL JBX-9500FSZ]]
''NB: Access to manuals require DTU login''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows|E-beam resists and process flows]]
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
*[[:Media:E-beam Lithography Lecture Tine Greibe 2015.pdf|Lecture on E-beam Lithography]]
*Manual Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=5073&mach=362 Spin Coater: Labspin 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=5074&mach=387 Spin Coater: Labspin 03]
 
*Maskless Aligners: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4975&mach=422 MLA 01] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6270&mach=440 MLA 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6618&mach=464 MLA 02]
 
*UV Mask Aligner: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3822&mach=339 MA6-2]
'''<big>Deep-UV Exposure</big>'''
*Automatic Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3561&mach=329 Developer: TMAH UV-lithography]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Stepper Lithography]]
*Manual Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3274&mach=324 Developer: TMAH Manual]
 
*Manual E-beam Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=20599&mach=527 Developer: E-beam Manual]
 
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'''<big>Development</big>'''
*[[:Media:Litho Tool Package - 4 Development v2 TARAN.pdf|TPT slides: Development]]
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.050_Developer_TMAH_UV-Lithography-720p.mp4 Training Video: Automatic Puddle Developer]'''
*[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.049_Developer_Manual-720p.mp4 Training Video: Manual Puddle Developer]'''
 
 
'''<big>Resists</big>'''
*[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|UV Resist Overview]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows|E-beam Resist Overview]]
 
 
'''<big>Inspection of Resist Patterns</big>'''
*[[:Media:Litho Tool Package - 5 Process effects and examples v2 TARAN.pdf|TPT slides: Process Effects and Examples]]




'''<big>Process Flows</big>'''
'''<big>Process Flows</big>'''
*[[:Media:Process_Flow_TPT first print.pdf|TPT first print process flow]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[:Media:Process_Flow_TPT alignment.pdf|TPT alignment process flow]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/FirstEBL#Resist_coating|E-beam resist process flows]]
 
|}
|}
<br clear="all" />
<br clear="all" />
*[[Specific Process Knowledge/Lithography/Tool_Package_Training|Lithography Tool Package Training]]

Latest revision as of 12:46, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

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Lithography

Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range ~1 µm and up
(resist type, thickness, and pattern dependent)		 ~200 nm and up
(pattern type, shape and pitch dependent)		 ~10-1000 nm
(and larger at high currents)		 ~20 nm and up
Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive:

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive:

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range ~0.5 µm to 200 µm ~50 nm to 2 µm ~30 nm to 1 µm ~100 nm to 2 µm
Typical exposure time Mask aligner: 10-180 s per wafer
Maskless aligner: 5-60 minutes per wafer

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose [µC/cm2]: Q
  • Beam current [A]: I
  • Pattern area [cm2]: a

Process time [s]: t=Q⋅aI

Process dependent, including heating/cooling rates
Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials Any standard cleanroom material Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment
 Any standard cleanroom material


Equipment and Process Pages

Pre-lithography


Getting started with UV lithography

Resist

Substrate Pre-treatment

Coating & baking


Automatic spin coating

Manual spin coating

Spray coating

Soft & hard baking

Exposure


UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography

Development


Manual development

SU-8 development

Semi-automatic puddle development

Automatic puddle development

Post-lithography


Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.

You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via training@nanolab.dtu.dk.

The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course here


TPT lithography course contents

  • Online lecture videos
  • Online quiz for each lecture video


Learning objectives

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


Course responsible

  • Jens Hindborg Hemmingsen
  • Thomas Aarøe Anhøj

If you have questions you can contact us via lithography@nanolab.dtu.dk


Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require DTU login


Process Flows


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