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==Coaters: Comparison Table==
{{cc-nanolab}}


[[Category: Equipment |Lithography coaters]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters click here]'''
 
[[Category: Equipment|Lithography coaters]]
[[Category: Lithography|Coaters]]
[[Category: Lithography|Coaters]]
[[Category: Thin Film Deposition|Coaters]]


__TOC__
=Coater Comparison Table=


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|Spin Coater: Süss Stepper]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual All Resists]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual Standard Resists]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual All Purpose]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_LabSpin_04|Spin Coater: LabSpin 04]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater|Spray Coater]]</b>
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Line 23: Line 28:
*In-line substrate HMDS priming
*In-line substrate HMDS priming
*Coating and baking of  
*Coating and baking of  
**AZ MiR 701 (29cps) resist
**AZ MiR 701 (29cps)
**AZ nLOF 2020 resist
**AZ nLOF 2020
**AZ 5214E
**AZ 5214E
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**BARC (DUV42S-6)
**KRF M230Y
**KRF M35G
**UVN2300-0.8
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*In-line substrate HMDS priming
*Coating and baking of  
*Coating and baking of  
**AZ MiR 701 (29cps) resist
**AR-P 6200 (CSAR)
**AZ nLOF 2020 resist
**AZ 5214E
*Post-exposure baking at 110°C
**AZ MiR 701 (29cps)
|style="background:WhiteSmoke; color:black"|
**AZ 4562
*Coating and baking of
*Edge bead removal on novolac-based resist and SU-8
**AZ5214E resist
**AZ4562 resist
**E-beam resist (for batches > 25 wafers)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating of
*Coating of
**SU-8 resist
**SU-8
**AZ 5214E resist
**AZ 5214E
**AZ 4562 resist
**AZ 4562
**AZ MiR resist
**AZ MiR
**AZ nLOF resist
**AZ nLOF
|style="background:WhiteSmoke; color:black"|
*Edge bead removal
*Coating of all resists
|colspan="2" style="background:WhiteSmoke; color:black"|
*Coating of E-beam resists
** CSAR, ZEP, PMMA/MMA, HSQ(FOx)
*Coating of UV resists
**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
*Coating of imprint resists
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating of
*Coating of
** CSAR
**SU-8
** ZEP
**mr-DWL
** PMMA/MMA
**other resists
** HSQ (FOx)
OBS: this tool is in PolyFabLab
**AZ 5214E resist
**AZ 4562 resist
**AZ MiR resist
**AZ nLOF resist
|style="background:WhiteSmoke; color:black"|
*Coating of
** CSAR
** ZEP
** PMMA/MMA
** HSQ (FOx)
**AZ 5214E resist
**AZ 4562 resist
**AZ MiR resist
**AZ nLOF resist
** ESPACER
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spraying imprint resist
*Spraying imprint resist
Line 72: Line 70:
*Spraying of other solutions
*Spraying of other solutions
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Cassette-to-cassette
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Cassette-to-cassette
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette  
* Cassette-to-cassette
* Edge handling chuck
* Vacuum handling and detection
* Vacuum spin chuck  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Single substrate
* Non-vacuum chuck for fragile substrates
* Vacuum chuck for 4" and 6"
* 4" non-vacuum chuck for fragile substrates
|colspan="2" style="background:WhiteSmoke; color:black"|
* Single substrate
* Vacuum chucks for chips, 2", 4", and 6"
* 4" edge handling chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Single substrate
* Edge handling chuck
* Vacuum chucks for chips, 4", and 6"
|colspan="2" align="center" style="background:WhiteSmoke; color:black"|Single substrate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Can handle almost any sample size and shape
Can handle almost any sample size and shape
|-
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 98: Line 107:
* PGMEA solvent for backside rinse and spinner bowl cleaning
* PGMEA solvent for backside rinse and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* DUV42S-6 (BARC)
* AZ nLOF 2020 resist
* KRF M230Y resist
* PGMEA for backside rinse and edge-bead removal
* KRF M35G resist
* PGMEA for spinner bowl cleaning and vapor tip bath
* PGMEA solvent for edge bead removal and backside rinse
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
* AZ4562 resist
* AZ5214E for 2", 4", and 6"
* Acetone for chuck cleaning
* AZ MiR 701 (29cps) for 4", and 6"
* Acetone for drip pan
* AZ4562 for 4", and 6"
* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
No permanent media
|colspan="3" rowspan="2" align="center" style="background:WhiteSmoke; color:black"|Only manual dispense
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
No permanent media
|-


|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* syringe dispense
* no manual dispense
* syringe dispense (60cc) of PGMEA-based resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no
* no manual dispense
* syringe dispense (60cc) of PGMEA and anisole-based resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
* no manual dispense
* syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* yes
* yes
* pneumatic dispense for SU-8 resist
* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Two syringe pumps
Two syringe pumps
|-


|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
*10 - 5000 rpm (3000 rpm with non-vacuum chuck)
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
10 - 5000 rpm (3000 rpm with non-vacuum chuck)
|colspan="2" style="background:WhiteSmoke; color:black"|
100 - 8000 rpm (3000 rpm with edge handling chuck)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 7000 rpm
100 - 8000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:LightGrey; color:black"|Gyrset
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
*optional
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*optional (max. speed 3000 rpm)
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
optional (max. speed 3000 rpm)
|colspan="2" style="background:WhiteSmoke; color:black"|
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:LightGrey; color:black"|Substrate  size
Line 172: Line 186:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*100 mm wafers
*150 mm wafers (tool change required)
*150 mm wafers
*200 mm wafers (may require tool change)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*2" or 50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
Line 180: Line 195:
*100 mm wafer
*100 mm wafer
*150 mm wafer  
*150 mm wafer  
|style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafers
*small pieces down to 10x10 mm2
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafer
*150 mm wafer
*small pieces down to 10x10 mm2
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafer
*150 mm wafer
*small pieces down to 3x3 mm2
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Any sample(s) that fit inside machine
Any sample(s) that fit inside machine
|-
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 24
1 - 25
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|colspan="2" style="background:WhiteSmoke; color:black"|
1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
*Glass
*Glass
'''No resist or crystalbond allowed in the HMDS module'''
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
*Glass
*Glass
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
*Silicon
|style="background:WhiteSmoke; color:black"|
*III-V materials
*All cleanroom materials except III-V materials
*Glass
 
'''No resist or crystalbond allowed in the HMDS module'''
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
All cleanroom materials except III-V materials
|colspan="2" style="background:WhiteSmoke; color:black"|
*Silicon
*III-V materials
*III-V materials
*Si, SiO2, SOI
*Glass
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
All PolyFabLab materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All chemicals to be spray coated must be approved specifically for spray coating
*All chemicals to be spray coated must be approved specifically for spray coating
Line 242: Line 256:
<br clear="all" />
<br clear="all" />


==SSE Spinner==
=Spin coating=
[[Image:SSEspinner2.jpg|300x300px|thumb|right|The SSE spinner MAXIMUS: positioned in E-5]]
The typical spin coating process consists of the following steps:
 
#Priming (typically HMDS) followed by cooling to room temperature
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#SSE_Spinner click here]'''
#Resist dispense (rotation: static or dynamic rotation)(arm: stationary or moving)
 
#*Optional: Acceleration to a low spin speed if dynamic dispense is used
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
#*Optional: Resist spreading at low spin speed for spreading thicker resists
 
#Spin-off
SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
#Backside rinse (typically during spin-off)
 
#Optional: Edge-bead removal
The system is equipped with 2 different resists lines:  
#Softbake (contact or proximity)
*AZ 5214E
#Cooling to room temperature
*AZ 4562
and
*2 syringe lines, which can be used for spinning of e-beam resist.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=188 LabManager]'''
 
===Process information===
 
The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake.
You need to create a separate recipe for each station and then collect the recipes in a flow. For the video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for the coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for the hotplates. After all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.
 
*[[Specific Process Knowledge/Lithography/Coaters/General SSE spinner process information|General SSE spinner process information]]
*[[Specific Process Knowledge/Lithography/Coaters/SSE Spinner AZ5214e coating|AZ5214E coating on SSE Spinner]]
 
''Flow names, process parameters, and test results:''
*'''_DCH_100mm_AZ5214E_1,5um'''
Spin-off: 10 s at 2300 rpm closed followed by 10s at 3500 rpm open.
 
Soft bake: 90 s at 90°C in contact
 
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
|-
 
|-
|-style="background:silver; color:black"
!Substrate
!Thickness
!Uniformity (+/-)
!Test date
!Tester initials
!Comments
|-
 
|-
|-style="background:WhiteSmoke; color:black"
|-
|Silicon with native oxide
|1,399
|3,1%
|28/1 2016
|chasil
|with HMDS. Average of 3 wafers
|-
|Silicon with native oxide
|1,418
|2,5%
|21/2 2016
|chasil
|with HMDS. Average of 3 wafers
|}
 
*'''_DCH_100mm_AZ5214E_2,2um'''
Spin-off: 40 s at 2200 rpm open.
 
Soft bake: 60 s at 90°C in contact
 
*'''_DCH_100mm_AZ5214E_1,5um'''
Spin-off: 60 s at 725 rpm open with exhaust closed followed by 10s at 3500 rpm open.
 
Soft bake: 90 s at 95°C in 1 mm proximity
 
<br clear="all" />
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating and soft baking E-beam resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E
* AZ4562
* E-beam resists
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ4562 6,2-25 µm
* E-beam resists 0,1-1 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* 90°C for softbaking of AZ5214E resist
* 100°C for softbaking of AZ4562 resist
* 110°C for reverse baking of AZ5214E resits
* 180°C for softbaking of e-beam resits
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 24
|-
|}
 
<br clear="all" />
 
==Spin Track 1 + 2==


[[image:SpinTrack.jpg|400px|right|thumb|Spin Track 1 + 2 in C-1]]


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]'''
After priming, the wafer is cooled to room temperature and then transferred to the spin coater. If static dispense is used, the wafer is not rotating during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. The dispense arm is normally stationary during dispense, but some substrates may require the arm to move slowly across the substrate area while dispensing. Moving arm dispensing is usually only done with a rotating substrate.


''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.


Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
==Spin-off==
The spin-off cycle determines the thickness of the resist coating. For a given resist, the thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law:


The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
<math>y = k \sdot x^{-a}</math>


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.


===Process information===
The coated thickness, <math>t</math>, as a function of the spin-off speed, <math>w</math>, follows an inverse power-law:
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#Post-exposure baking (PEB)|Post-exposure baking on Spin Track 2]]


=== Equipment performance and process related parameters ===
<math>t=k \sdot w^{-a}</math>


{| border="2" cellspacing="0" cellpadding="2"
The constant, <math>k</math>, is a function of the resist viscosity and solid content, as well as the spin-off time. The exponent, <math>a</math>, is dependent on solvent evaporation, and is typically ~½ for UV resists. This means that from the thickness <math>t_1</math> achieved at spin speed <math>w_1</math>, one can estimate the spin speed <math>w_2</math> needed to achieve thickness <math>t_2</math> using the relation:


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
<math>t_1 \sdot w_1^{1/2} = t_2 \sdot w_2^{1/2} \rArr w_2 = w_1 \sdot \frac{t_1^2}{t_2^2}</math>
|style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating and soft baking
*Priming, coating, and baking
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating and soft baking
*Priming, coating, and baking
*Post-exposure baking
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ MiR 701 (29cps)


positive tone
|style="background:WhiteSmoke; color:black" align="center"|
AZ nLOF 2020


negative tone
For thick SU-8, however, <math>a</math> is observed to be ~1 (probably due to the low solvent content and/or the formation of skin). In this case, the relation simply becomes:
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
1 - 3 µm
|style="background:WhiteSmoke; color:black" align="center"|
1 - 4 µm
|-
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
60° - 90°; standard recipe 82° (on SiO2)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 9990 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1000 - 50000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
90°C
|style="background:WhiteSmoke; color:black" align="center"|
110°C
|-
|style="background:LightGrey; color:black"|HMDS priming temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
50°C
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Silicon and glass wafers


Film or pattern of all types
<math>t_1 \sdot w_1 = t_2 \sdot w_2 \rArr w_2 = w_1 \sdot \frac{t_1}{t_2}</math>
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 25
|-
|}
 
<br clear="all" />


==Spin Coater: Gamma UV==
==Backside rinse==
If the spin speed is too low during resist dispense, resist may creep over the edge of the wafer and onto the backside. Some resist tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy".


[[image:SpinCoaterGammaUV.jpg|400px|right|thumb|Spin Coater: Gamma UV in E-5]]
Any resist on the edge and backside of the wafer will contaminate the end effector, softbake hotplate, and subsequent wafers.  


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV click here]'''
In a backside rinse step, solvent administered through a nozzle to the backside of the wafer, while spinning at low or medium spin speed, dissolves the resist and washes it away. After the rinse, a short spin at medium spin speed dries the wafer before the softbake.  


''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
During the backside rinse solvent inevitably creeps onto the front side of the wafer. This effect may be used to dissolve and subsequently remove an edge-bead, but it may also leave the rim of the wafer exposed. As an alternative to backside rinse, a wafer, which is contaminated on the backside, may be softbaked in proximity, in order to protect the hotplate from contamination. This leaves front side coating intact, but also leaves the backside dirty.


Spin Coater: Gamma UV was installed at Danchip in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, vapour priming, and baking modules. The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
==Edge bead==
During spin coating, resist builds up at the edge of the wafer due to the change in surface tension at the edge, as well as extra drying from turbulence created by the wafer edge.


The coater is equipped with 3 different resists lines:
This phenomenon is called edge-bead. Dependent on spin coating parameters, the coating may be several times thicker at the edge than in the central area. In a subsequent hard contact exposure step (mask aligner), this edge-bead introduces an undesired proximity gap, which reduces the lateral resolution, and may even cause the wafer to stick to the mask.  
*AZ MiR 701
*AZ nLOF 2020
*AZ 5214E 
and
*1 syringe, which can be used for various resists.


The processes that are available on the system are developed by Danchip. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
In an edge-bead removal step, solvent administered through a nozzle positioned at the edge of the wafer, while spinning at low or medium spin speed, dissolves the resist and washes it away. After the removal, a short spin at medium spin speed dries the wafer before the softbake. Dependent on the viscosity (solvent content) of the resist after the edge-bead removal, this drying spin may cause the resist to re-flow and create a secondary edge-bead. In some cases, it may be necessary to (partially) softbake the resist before edge-bead removal.


'''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.055_Spin_Coater_GAMMA_UV-720p.mp4 Training video]'''
==Softbake==
After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''
=Spin coaters at DTU Nanolab=


===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]===
{{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}


[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes:]]
{{:Specific Process Knowledge/Lithography/Coaters/GammaDUV}}
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#HMDS_priming_2|HMDS]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_MiR_701_.2829cps.29_coating|AZ MiR 701]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_nLOF_2020_coating|AZ nLOF 2020]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_5214E_coating|AZ 5214E]]


=== Equipment performance and process related parameters ===
{{:Specific Process Knowledge/Lithography/Coaters/GammaEbeam}}


{| border="2" cellspacing="0" cellpadding="2"
{{:Specific Process Knowledge/Lithography/Coaters/RCD8}}


{{:Specific Process Knowledge/Lithography/Coaters/labspin}}


!style="background:silver; color:black;" align="center" width="60"|Purpose
{{:Specific Process Knowledge/Lithography/Coaters/labspin04}}
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating of PGMEA based UV resists
*Spin coating of E-beam resists <sup>1)</sup>
*Soft baking
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps)
* AZ nLOF 2020
* AZ 5214E
* 100cc syringe dispense
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center"|
60 - 80°
|-
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701: 1.5-4 µm
* AZ nLOF 2020: 1.5-5 µm
* AZ 5214E: 1.5-5 µm
* AZ 4562: 5-15 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
|style="background:LightGrey; color:black"|Priming temperature
|style="background:WhiteSmoke; color:black" align="center"|
25 - 120 °C
|-
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
10 - 6000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
10 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
25 - 200 °C
|-
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:WhiteSmoke; color:black" align="center"|
21 °C
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers <sup>1)</sup>
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers <sup>1)</sup>
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon and glass
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25
|-
|}
 
<sup>1)</sup> Requires tool change.
 
<br clear="all" />
 
==Spin Coater: RCD8==
[[Image:Spinner_RCD8_C-1.jpg|300x300px|thumb|Spin coater: RCD8 is located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8 click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater can also be used for coating of substrates with e.g. textured backsides or membranes.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''
 
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Standard recipes|Standard recipes]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Template recipes|Template recipes]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating of SU-8 resists
*Spin coating of PGMEA based AZ resists
*Spin coating of wafers with structured backside
*Edge bead removal
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* manual dispense
* automatic dispense from syringe
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black"|
* SU-8 resits: 0.1-200+ µm
* AZ 5214E: 1.5-3 µm
* AZ 4562: 8-15 µm
* AZ MiR 701: 1.5-3 µm
* AZ nLOF 2020: 2-3.5 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
Vacuum chuck: 10 - 5000 rpm <br>
Non-vacuum chuck: Max. 3000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
10 - 3000 rpm/s <br>
Max. 1500 rpm/s with Gyrset
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
All cleanroom materials ?
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-
|}
 
<br clear="all" />
 
== Manual Spin Coaters ==
 
''Go back to [[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''.
 
 
{| cellpadding="2" style="border: 2px solid darkgray;" align="right"
! width="350" |
! width="350" |
! width="350" |
 
|- border="0" align="center"
|[[Image:Spin coater Manual Labspin in A-5.jpg|300px]]
|[[Image:StandardResists.jpg|300px]]
|[[Image:IMG 1175.JPG|300px]]
 
 
 
|- align="center"
| '''Spin Coater: Manual All Resists''' ||  '''Spin Coater: Manual Standard Resists''' || '''Spin Coater: Manual All Purpose'''
 
|- align="center"
| Loacted in fumehood in A-5 ||  Located in fumehood in E-5|| Located in fumehood in C-1
 
|- align="center"
| Labspin 6, Süss || Labspin 6, Süss  || WS-650, Laurell
 
|- align="center"
| '''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=362 LabManager]''' || '''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=331 LabManager]'''  || '''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=315 LabManager]'''
 
|}


{{:Specific Process Knowledge/Lithography/Coaters/sprayCoater}}


'''Training video: [http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.057_Manual_Spin_Coater-720p.mp4 LabSpin6]'''
=Decommisioned tools=
<span style="color:red">The spin track was decommissioned 2018-02-01.</span>


Spin curves: [[media:AZ5214E_spin_curve.pdf‎|AZ5214E‎]], [[media:Spin_curve_nLoF2020.pdf‎|AZnLoF 2020]], [[media:Spin_curve_ZEP520A.pdf‎|ZEP520A‎]], [[media:Spin_curve_Fox-15.pdf| FOX-15]]
[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters"