Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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Content and illustration by Thomas Pedersen, DTU Nanolab unless otherwise noted. | Content and illustration by Thomas Pedersen, DTU Nanolab unless otherwise noted. | ||
[[ | [[Category:Equipment|Lithography exposure]] | ||
[[ | [[Category:Lithography|Exposure]] | ||
<div class="keywords" style="display:none;">ebl e-beam writer e-beamwriter ebeamwriter e-beamlithography</div> | <div class="keywords" style="display:none;">ebl e-beam writer e-beamwriter ebeamwriter e-beamlithography</div> | ||
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=Quick links= | =Quick links= | ||
[[Specific Process Knowledge/Lithography/Resist#E-beam Resist|E-beam Resist]] | |||
[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLRequest|Exposure slot request]] | [[Specific Process Knowledge/Lithography/EBeamLithography/JEOLRequest|Exposure slot request]] | ||
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[[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|Beamer guide]] | [[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|Beamer guide]] | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/EBLProcessExamples|EBL process examples]] | [[Specific Process Knowledge/Lithography/EBeamLithography/EBLProcessExamples|EBL process examples]] | ||
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|[[File:thope.png|150px]] || [[File:pxshi.png|150px]] || [[File:elelop.png|150px]] || [[File:meenadh.png|150px]] | |[[File:thope.png|150px|link=]] | ||
||[[File:pxshi.png|150px|link=]] | |||
||[[File:elelop.png|150px|link=]] | |||
||[[File:meenadh.png|150px|link=]] | |||
||[[File:rawta.png|150px|link=]] | |||
|- | |- | ||
|[mailto:thope@dtu.dk Thomas Pedersen] | |[mailto:thope@dtu.dk Thomas Pedersen] | ||
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|| [mailto:meenadh@dtu.dk Meena Dhankhar] | || [mailto:meenadh@dtu.dk Meena Dhankhar] | ||
Raith E-Line | Raith E-Line | ||
|| [mailto:rawta@dtu.dk Rawa Tanta] | |||
JEOL 9500 & Raith E-Line | |||
|} | |} | ||
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t = D*A/I | t = D*A/I | ||
It is thus essential to find the right balance between the area that needs to be defined and a beam current that will provide sufficient pattern fidelity and quality. During pattern writing the tool will also use time on cyclic calibration and stage movement as defined by the job path and pattern layout. The exposure time can be estimated based | It is thus essential to find the right balance between the area that needs to be defined and a beam current that will provide sufficient pattern fidelity and quality. During pattern writing the tool will also use time on cyclic calibration and stage movement as defined by the job path and pattern layout. [https://labmanager.dtu.dk/function.php?module=Machine&view=jeol_writing_time The exposure time can be estimated based here.] | ||
= Exposure information = | = Exposure information = | ||
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Pattern preparation is somewhat different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct pattern preparation section below. | Pattern preparation is somewhat different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct pattern preparation section below. | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLPatternPreparation|Pattern preparation for exposure on JEOL 9500 | *[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLPatternPreparation|Pattern preparation for exposure on JEOL 9500]] | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/RaithPatternPreparation|Pattern preparation for exposure on Raith eLine Plus | *[[Specific Process Knowledge/Lithography/EBeamLithography/RaithPatternPreparation|Pattern preparation for exposure on Raith eLine Plus]] | ||
== Job preparation == | == Job preparation == | ||
Job preparation is also different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct job preparation section below. | Job preparation is also different depending on if a pattern is exposed on JEOL 9500 or Raith eLine Plus. Please refer to the correct job preparation section below. | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation|Job preparation for exposure on JEOL 9500 | *[[Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation|Job preparation for exposure on JEOL 9500]] | ||
[[Specific Process Knowledge/Lithography/EBeamLithography/RaithJobPreparation|Job preparation for exposure on Raith eLine Plus | *[[Specific Process Knowledge/Lithography/EBeamLithography/RaithJobPreparation|Job preparation for exposure on Raith eLine Plus]] | ||
== Job execution == | == Job execution == | ||