Specific Process Knowledge/Lithography/SU-8: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/SU-8 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/SU-8 click here]''' | ||
[[Category:Lithography|Resist]] | [[index.php?title=Category:Lithography|Resist]] | ||
[[Category:Resist|SU-8]] | [[index.php?title=Category:Resist|SU-8]] | ||
__TOC__ | __TOC__ | ||
==Resist description== | ==Resist description== | ||
SU-8 is an epoxy based negative i-line photoresist with a high contrast. More | SU-8 is an epoxy based negative i-line photoresist with a high contrast. More than 10:1 aspect ratio imaging with vertical sidewalls is one of the widely used properties of this resist. It also has high chemical, plasma and temperature resistance after curing which makes it well suited for permanent use applications. | ||
<span style="color:red">'''Note:''' Since the SU-8 is epoxy-based, users are required to take the mandatory epoxy safety course "Personlig sikkerhed ved arbejde med epoxy". Registration to this course can be found on [https://www.inside.dtu.dk/en/medarbejder/hr-og-arbejdsmiljoe/kompetenceudvikling/kursusoversigt_overside/kursusoversigt/arbejdsmiljoe-og-beredskabskurser/epoxy-kursus?fs=1 DTU Inside]</span> - '''requires login''' | <span style="color:red">'''Note:''' Since the SU-8 is epoxy-based, users are required to take the mandatory epoxy safety course "Personlig sikkerhed ved arbejde med epoxy". Registration to this course can be found on [https://www.inside.dtu.dk/en/medarbejder/hr-og-arbejdsmiljoe/kompetenceudvikling/kursusoversigt_overside/kursusoversigt/arbejdsmiljoe-og-beredskabskurser/epoxy-kursus?fs=1 DTU Inside]</span> - '''requires login''' | ||
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* Dispense manually from bottle/syringe for the thin resists or use a syringe dispense system for the thick resists | * Dispense manually from bottle/syringe for the thin resists or use a syringe dispense system for the thick resists | ||
* Use static dispense; approximately 1 ml of SU-8 per inch of substrate diameter | * Use static dispense; approximately 1 ml of SU-8 per inch of substrate diameter | ||
* For SU-8 layers thicker | * For SU-8 layers thicker than 100 um use two-step spin coating procedure: | ||
** 5 second spread cycle 500 rpm, acceleration 100 rpm/s, following by: | ** 5 second spread cycle 500 rpm, acceleration 100 rpm/s, following by: | ||
** thickness definition cycle with the final spin speed | ** thickness definition cycle with the final spin speed | ||
** layer uniformity of the thick films can be improved by using a rotation cover (Gyrset), but remember the speed limitation is then 3000 rpm | ** layer uniformity of the thick films can be improved by using a rotation cover (Gyrset), but remember the speed limitation is then 3000 rpm | ||
* For SU-8 layers thinner | * For SU-8 layers thinner than 10 um the spread cycle can be omitted to improve the uniformity of the films | ||