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{{:Specific Process Knowledge/Lithography/authors_generic}}
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters click here]'''
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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_LabSpin_04|Spin Coater: LabSpin 04]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater|Spray Coater]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater|Spray Coater]]</b>
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
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**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
*Coating of imprint resists
*Coating of imprint resists
|style="background:WhiteSmoke; color:black"|
*Coating of
**SU-8
**mr-DWL
**other resists
OBS: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spraying imprint resist
*Spraying imprint resist
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*Spraying of other solutions
*Spraying of other solutions
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Substrate handling
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* 4" edge handling chuck
* 4" edge handling chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Can handle almost any sample size and shape
* Single substrate
* Vacuum chucks for chips, 4", and 6"
|style="background:WhiteSmoke; color:black"|
Can handle almost any sample size and shape
|-
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
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* KRF M230Y resist
* KRF M230Y resist
* KRF M35G resist
* KRF M35G resist
* PGMEA solvent for edge bead removal and backside rinse
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
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* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning
* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
No permanent media
|colspan="2" rowspan="2" align="center" style="background:WhiteSmoke; color:black"|Only manual dispense
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
No permanent media
|-


|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* yes
* yes
* pneumatic dispense for SU-8 resist and EBR solvent
* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Two syringe pumps
Two syringe pumps
|-


|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 6000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 5000 rpm (3000 rpm with non-vacuum chuck)
10 - 5000 rpm (3000 rpm with non-vacuum chuck)
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm (3000 rpm with edge handling chuck)
100 - 8000 rpm (3000 rpm with edge handling chuck)
|style="background:WhiteSmoke; color:black"|
100 - 8000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:LightGrey; color:black"|Gyrset
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*optional (max. speed 3000 rpm)
optional (max. speed 3000 rpm)
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:LightGrey; color:black"|Substrate  size
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*100 mm wafers
*100 mm wafers
*150 mm wafer
*150 mm wafer
*small pieces down to 10x10 mm2
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Any sample(s) that fit inside machine
*100 mm wafers
*150 mm wafer
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
Any sample(s) that fit inside machine
|-
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 - 25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*1
1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|style="background:WhiteSmoke; color:black"|
1
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
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*Glass
*Glass


No resist or crystalbond allowed in the HMDS module
'''No resist or crystalbond allowed in the HMDS module'''
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
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*Glass
*Glass


No resist or crystalbond allowed in the HMDS module
'''No resist or crystalbond allowed in the HMDS module'''
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
All cleanroom materials except III-V materials
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
*III-V materials
*III-V materials
*Glass
*Glass
|style="background:WhiteSmoke; color:black"|
All PolyFabLab materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All chemicals to be spray coated must be approved specifically for spray coating
*All chemicals to be spray coated must be approved specifically for spray coating
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=Spin coating=
=Spin coating=
The typical spin coating process consists of the following steps:
The typical spin coating process consists of the following steps:
#Priming (typically HMDS)
#Priming (typically HMDS) followed by cooling to room temperature
#Resist dispense (static or dynamic)
#Resist dispense (rotation: static or dynamic rotation)(arm: stationary or moving)
#*Optional: Acceleration to a low spin speed if dynamic dispense is used
#*Optional: Acceleration to a low spin speed if dynamic dispense is used
#*Optional: Resist spreading at low spin speed
#*Optional: Resist spreading at low spin speed for spreading thicker resists
#Spin-off
#Spin-off
#Backside rinse (typically during spin-off)
#Backside rinse (typically during spin-off)
#Optional: Edge-bead removal
#Optional: Edge-bead removal
#Softbake (contact or proximity)
#Softbake (contact or proximity)
#Cooling to room temperature


After priming, the wafer is cooled to room temperature and then transferred to the spin coater. If static dispense is used, the wafer is not rotating during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. The dispense arm is normally stationary during dispense, but some substrates may require the arm to move slowly across the substrate area while dispensing. Moving arm dispensing is usually only done with a rotating substrate.


After priming, the wafer is is transferred to the spin coater. If static dispense is used, the wafer remains static during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.  
Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.  


==Spin-off==
==Spin-off==
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==Softbake==
==Softbake==
After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface while resting on shallow bumps only 150 µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.
After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.


=Spin coaters at DTU Nanolab=
=Spin coaters at DTU Nanolab=
==Spin track==
<span style="color:red">The spin track was decommissioned 2018-02-01.</span>
[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]


{{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
{{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
Line 287: Line 327:


{{:Specific Process Knowledge/Lithography/Coaters/labspin}}
{{:Specific Process Knowledge/Lithography/Coaters/labspin}}
{{:Specific Process Knowledge/Lithography/Coaters/labspin04}}


=Spray Coater=
=Spray Coater=
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==Equipment performance and process related parameters==
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters"