Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions
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==Spin Coater: RCD8== | ==Spin Coater: RCD8== | ||
[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in | [[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in E-4]] | ||
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. | Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024. | ||
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | ||
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager] - '''requires login''' | |||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing# | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Dispense|Dispense]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]] | ||
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=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
{| border=" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Spin coating of PGMEA based AZ resists | *Spin coating of PGMEA based AZ resists | ||
*Spin coating of wafers with structured backside | *Spin coating of wafers with structured backside | ||
*Edge bead removal | *(Edge bead removal) | ||
|- | |- | ||
!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* manual dispense | * manual dispense | ||
* automatic dispense from syringe | * <strike>automatic dispense from syringe</strike> | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* SU-8 | * SU-8 resists: 0.1-200+ µm | ||
* AZ 5214E: 1.5-3 µm | * AZ 5214E: 1.5-3 µm | ||
* AZ 4562: 8-15 µm | * AZ 4562: 8-15 µm | ||