Specific Process Knowledge/Etch/Wet Polysilicon Etch: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Polysilicon_Etch click here]''' | ||
[[Category: Equipment|Etch Wet Polysilicon]] | '''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab. | ||
[[Category: Etch (Wet) bath|Polysilicon]] | |||
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.''' | |||
'''All measurements on this page has been made by Nanolab staff.''' | |||
[[index.php?title=Category:Equipment|Etch Wet Polysilicon]] | |||
[[index.php?title=Category:Etch (Wet) bath|Polysilicon]] | |||
==Wet PolySi Etch== | ==Wet PolySi Etch== | ||
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The PolySi Etch is typically used for opening holes in poly-silicon thin-films, using photoresist as an etch mask or to strip Poly silicon of a wafer. Due to its isotropic nature the under-etching (etch-bias) at least amounts to the thickness of the poly-silicon layer. Another example of usage is etching of "circular-shaped" holes in silicon substrates. | The PolySi Etch is typically used for opening holes in poly-silicon thin-films, using photoresist as an etch mask or to strip Poly silicon of a wafer. Due to its isotropic nature the under-etching (etch-bias) at least amounts to the thickness of the poly-silicon layer. Another example of usage is etching of "circular-shaped" holes in silicon substrates. | ||
The PolySi Etch is based on the combined oxidation of silicon followed by | The PolySi Etch is based on the combined oxidation of silicon (by nitric acid) followed by an etch of the formed silicon oxide (by hydrofluoric acid). The etch solution consists of: | ||
HNO<sub>3</sub> : BHF : H<sub>2</sub>O - (20 : 1 : 20) | HNO<sub>3</sub> : BHF : H<sub>2</sub>O - (20 : 1 : 20) | ||
'''NB: The life time of the solution is a few days to | '''NB: The life time of the solution is a few days to 4 weeks. There are dummy wafers placed in the drawer which can be used for testing the etchrate.''' | ||
'''The user manual and contact information can be found in LabManager:''' | '''The user manual and contact information can be found in LabManager:''' | ||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=379 | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=379 Poly Si Etch info page in LabManager] | ||
===PolySi Etch data=== | ===PolySi Etch data=== | ||