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'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Chrominum_Etch click here]'''
'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Chrominum_Etch click here]'''
 
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
 
'''All measurements on this page has been made by Nanolab staff.'''
 
[[index.php?title=Category:Equipment|Etch Wet Chromium]]
[[index.php?title=Category:Etch (Wet) bath|Chromium]]


==Wet etching of Chromium==
==Wet etching of Chromium==
[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]]
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.]]
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. You can see the APV [http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].
Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].
We have two solutions for this:
 
We use the following solution to etch chromium:


# Commercial chromium etch (Chrome Etch 18). You can see the KBA [http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 here]
# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]
# HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate  - 90ml:1200ml:15g
Etch rate are depending on the level of oxidation of the metal.


====How to mix the Chromium etch 2:====
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
#Take a beaker and add 15g of cerisulphate.
#Add a little water while stirring - make sure all lumps are gone.
#Add water until 600 ml - keep stirring (use magnetic stirring)
#Add 90 ml HNO<sub>3</sub>
#When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.


PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured)


<br clear="all" />
Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste.


===Overview of the data for the chromium etches===
===Overview of the chromium etch process===
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-
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!
!
! Chromium etch 1
! Chromium etch 1
! Chromium etch 2
|-  
|-  


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!General description
!General description
|
Etch of chromium
|
|
Etch of chromium
Etch of chromium
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Link to safety APV and KBA
!Link to safety APV and KBA
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].  
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here]
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]  
|-
|-


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!Chemical solution
!Chemical solution
|Chrome Etch 18
|Chrome Etch 18
|HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate  - 90ml:1200ml:15g
|-
|-


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!Process temperature
!Process temperature
|Room temperature
|Room temperature
|Room Temperature


|-
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Possible masking materials
!Possible masking materials
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|-
|-
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Etch rate
!Etch rate
|~ ? nm/min
|~ 150 nm/min at 22°C
|~40-100 nm/min  
|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Batch size
!Batch size
|1-7 4" wafers at a time
|1-7 4" wafers at a time
|1-7 4" wafers at a time
|-
|-
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!Size of substrate
!Size of substrate
|Any size and number that can go inside the beaker in use   
|Any size and number that can go inside the beaker in use   
|Any size and number that can go inside the beaker in use
|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Allowed materials
!Allowed materials
|No restrictions.
Make a note on the beaker of which materials have been processed.
|No restrictions.  
|No restrictions.  
Make a note on the beaker of which materials have been processed.
Make a note on the beaker of which materials have been processed.
|-
|-
|}
|}
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