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=The Molecular Vapor Deposition Tool =
{{cc-nanolab}}


[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom 1]]
'''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]'''


The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. They are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present. In most cases the chlorine atoms in the end of an flourinated organosilane react with -OH groups of the surface to form a chemical bond under elimination of HCL.
[[index.php?title=Category:Equipment|Thin film MVD]]
[[index.php?title=Category:Thin Film Deposition|MVD]]


{| border="2" cellpadding="2" cellspacing="1"  
== The Molecular Vapor Deposition tool ==
|+ The flat recipe
 
[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]]
 
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.
 
'''As per Jan 2025 the O2 plasma is no longer possible to use, we recommend to use a plasma asher before use and then run Flat2NP and Stamp2NP respectively, where NP is for No Plasma. - rkc'''
 
 
 
'''The user manual, user APV, and contact information can be found in LabManager:'''
 
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=199 MVD in LabManager]
 
==Process information==
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating|Processing on the MVD]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The FLAT recipe|The FLAT recipe]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The STAMP recipe|The STAMP recipe]]
 
 
== Equipment performance and process related parameters ==
 
{| border="2" cellspacing="0" cellpadding="2"  
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*FDTS coating of Si or SiO2 surfaces
*Indirect O2 plasma treatment
|-
|-
! rowspan="3" align="center"| O<sub>2</sub> plasma
!style="background:silver; color:black;" align="center" width="60"|Vapor sources
! Flow
|style="background:LightGrey; color:black"|Line
| 200 sccm
*1
*2
*3
*4
|style="background:WhiteSmoke; color:black"|Chemical
*Water
*FDTS (new source, 2013)
*FDTS (old source, contaminated line)
*Available (line probably contaminated, no source heater)
|-
|-
! Power
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
| 250 Watts
|style="background:LightGrey; color:black"|Contact angle
|style="background:WhiteSmoke; color:black" align="center"|
110° (water)
|-
|-
! Time
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
| 300 seconds
|style="background:LightGrey; color:black"|Base pressure
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
20 mTorr
|-
|-
! rowspan="4" align="center"| Chemical # 1 (vapor order 1)
|style="background:LightGrey; color:black"|Chamber temperature
! Name
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| FDTS
35°C
|-
|-
! Line no.
|style="background:LightGrey; color:black"|Chamber volume
| 3
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Approx. 3 liters
|-
|-
! Cycles
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| 4
|style="background:LightGrey; color:black"|Substrate size
|-
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
! Pressure
1" to 8"
| 0.500 Torr
 
|-
Smaller samples may be processed if fixed to a carrier
! rowspan="4" align="center"| Chemical # 2 (vapor order 2)
! Name
| Water
|-
! Line no.
| 1
|-
|-
! Cycles
| style="background:LightGrey; color:black"|Allowed materials
| 1
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except steel and other ferrous materials
|-
|-
! Pressure
|style="background:LightGrey; color:black"|Batch
| 18 Torr
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|-
One sample at a time
! Processing
! Time
| 900 seconds
|-
! Temperature
| 10<sup>o</sup>C
! SF<sub>6</sub> Flow
| 260 sccm
| 0 sccm
|-
! No. of cycles
| 31
! O<sub>2</sub> Flow
| 26 sccm
| 0 sccm


Two 4" or 6" wafers may be processed simultaneously using cassettes
|-
|}
|}
<br clear="all" />
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