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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]'''
'''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]'''
 
[[index.php?title=Category:Equipment|Thin film MVD]]
[[index.php?title=Category:Thin Film Deposition|MVD]]


== The Molecular Vapor Deposition tool ==
== The Molecular Vapor Deposition tool ==


[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom 1]]
[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]]
 
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.
 
'''As per Jan 2025 the O2 plasma is no longer possible to use, we recommend to use a plasma asher before use and then run Flat2NP and Stamp2NP respectively, where NP is for No Plasma. - rkc'''
 
 
 
'''The user manual, user APV, and contact information can be found in LabManager:'''
 
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=199 MVD in LabManager]
 
==Process information==
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating|Processing on the MVD]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The FLAT recipe|The FLAT recipe]]
*[[Specific Process Knowledge/Thin film deposition/Antistiction Coating#The STAMP recipe|The STAMP recipe]]
 
 
== Equipment performance and process related parameters ==
 
{| border="2" cellspacing="0" cellpadding="2"


The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At Danchip the MVD is essential for nanoimprint lithography.
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*FDTS coating of Si or SiO2 surfaces
*Indirect O2 plasma treatment
|-
!style="background:silver; color:black;" align="center" width="60"|Vapor sources
|style="background:LightGrey; color:black"|Line
*1
*2
*3
*4
|style="background:WhiteSmoke; color:black"|Chemical
*Water
*FDTS (new source, 2013)
*FDTS (old source, contaminated line)
*Available (line probably contaminated, no source heater)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Contact angle
|style="background:WhiteSmoke; color:black" align="center"|
110° (water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Base pressure
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
20 mTorr
|-
|style="background:LightGrey; color:black"|Chamber temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
35°C
|-
|style="background:LightGrey; color:black"|Chamber volume
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Approx. 3 liters
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1" to 8"


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
Smaller samples may be processed if fixed to a carrier
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except steel and other ferrous materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
One sample at a time


===Process information===
Two 4" or 6" wafers may be processed simultaneously using cassettes
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
|-
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
|}


=== Equipment performance and process related parameters ===
<br clear="all" />
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