Specific Process Knowledge/Back-end processing/FlipScribe: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe click here]''' | ||
The Cleaver: FlipScribe is a scriber designed for cleaving/scribing wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath | '''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | ||
=The Cleaver: FlipScribe= | |||
The Cleaver: FlipScribe is a scriber designed for cleaving/scribing wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fume hood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5. | |||
[[File:flipscribe.JPG|400px]] | [[File:flipscribe.JPG|400px]] | ||
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The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information. | The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information. | ||
DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the [ | DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe LatticeAxe]''' for more information. | ||