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{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
 
|+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications'''
 
 
TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire.
The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire. 
 
 
 
{| border="2" cellpadding="2" cellspacing="1"  
|+ '''Technical Specifications'''
|-
|-
! rowspan="6" align="center"| Bonding Specifications
! rowspan="4" align="center" style="background:#f0f0f0;"| Bonding Specifications
| Bonding Methods
| Bonding Methods
| Wedge-Wedge, Ball-Wedge, Ribbon
| Wedge–Wedge, Ball–Wedge, Ribbon, Bump
|-
| Bond Head Capability
| One head for Wedge & Ball bonding (tool change only)
|-
|-
| Wire Diameter (Gold)
| Wire Diameter (Gold)
| 12–75 µm
| 12–75 µm (0.5–3 mil)
|-
|-
| Wire Diameter (Aluminium)
| Wire Diameter (Aluminium)
| 17–75 µm
| 17–75 µm (0.7–3 mil)
|-  
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Wire & Ribbon Handling
| Ribbon Size
| Ribbon Size
| Up to 25 × 250 µm
| Max. 25 × 250 µm (1 × 10 mil)
|-
| Wire Spool Size
| 2" diameter
|-
|-
| Wire Feed Angle / Immersion Depth
| 90° deep access / 14 mm immersion
|-
! rowspan="6" align="center" style="background:#f0f0f0;"| Ultrasonic & Bonding Parameters
| Ultrasonic Frequency
| Ultrasonic Frequency
| 63.3 kHz (110 kHz option)
| 63.3 kHz PLL control (110 kHz option)
|-
| Ultrasonic Power
| 0–10 W
|-
| Bond Time
| 0–5 seconds
|-
|-
| Bond Force
| Bond Force
| 10–200 cN
| 10–200 cN
|-
|-
! rowspan="3" align="center"| Motion & Control
| Bonding Tool Size
| X-Y Travel / Resolution
| 1.58 mm Ø × 19 mm length (0.0624" × 0.750")
| 100 mm / 0.1 µm
|-
| Wire Termination
| Bond Head Tear or Clamp Tear
|-
! rowspan="6" align="center" style="background:#f0f0f0;"| Mechanics & Motion Control
| Z-Drive / Resolution
| Lead screw motor / 0.5 µm
|-
| Motorized Z Travel
| 100 mm (3.9")
|-
| X–Y Drive / Resolution
| Linear motors / 0.1 µm
|-
| Motorized X–Y Travel
| 100 mm (3.9")
|-
|-
| Z Travel / Resolution
| Max. Component Width
| 100 mm / 0.5 µm
| 400 mm (15.7")
|-
|-
| Rotation Accuracy
| Rotation Drive Accuracy
| ±0.5°
| ±0.5°
|-  
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Control & Interface
| Axis Control
| Joystick
|-
| Screen Size
| 21" touchscreen
|-
| Software Environment
| Industrial PC with Windows
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Camera & Optics
| Camera System
| Dual camera (detail + overview)
|-
| Magnification
| Up to 150×
|-
| View Mode
| Simultaneous detail & overview
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Heater Stage
| Size
| 90 mm Ø surface (mechanical & vacuum clamping)
|-
| Temperature Range
| Up to 200 °C ±1 °C
|-
| Clamping
| Mechanical & vacuum
|-
|}
''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''
-------------------------------------
The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person.
The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.
=== HB100 Bonding Parameters – 25 µm Gold Wire===
 
{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
|+ style="font-weight:bold; font-size:110%;" |
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| First Bond
| Ultrasonic Power (US)
| 160
|-
| Bond Time
| 80
|-
| Bond Force
| 350
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Second Bond
| Ultrasonic Power (US)
| 180
|-
| Bond Time
| 80
|-
| Bond Force
| 350
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Wire
| Wire Diameter
| 25 µm (Gold)
|-
| Wire Detect
| First Bond: 20 / Second Bond: 0
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Loop
| Loop Height
| 500-2500
|-
| Tail Mode (Clamp Feed Length)
| 200-350
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Temperature
|-
| Stage
|80-120
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Bond Positions
| First Bond (X1, Y1)
| Teach first bond
|-
| Second Bond (X2, Y2)
|Teach second bond
|-
|}
|}




===Process parameters for Gold wire (25µm)===
* For  more details contact  thcl@dtu.dk or prakus@dtu.dk
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