Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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=TPT HB100 Wire Bonder = | =TPT HB100 Wire Bonder = | ||
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought | Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | ||
[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]] | |||
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder] | [https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder] | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Al and Au 25µm wire bonding | *Al and Au 25µm wire bonding | ||
*Wedge and ball wire bonding | *Wedge and ball wire bonding | ||
* Au ribbon (100x20µm) bonding<br /> | * Au ribbon (100x20µm) bonding<br /> | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Au 25µm wire bonding | *Au 25µm wire bonding | ||