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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
=TPT HB100 Wire Bonder =
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.


==TPT Wire Bonder==
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 2nd floor]]


The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.
[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
<!-- remember to remove the type of documents that are not present -->


<!-- give the link to the equipment info page in LabManager: -->
=Ball Wire Bonder K&S 4524=
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder]
<!-- copyright issue kabi - replace with actual photo and numbering
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
-->


==Ball Wire Bonder K&S 4524==
[[Image:K-S 4524 wirebonder DTU.jpg|thumb|200px|K&S 4524 ball wire bonder]]
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 2nd floor]]
 
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
<span style="background:#FF2800">The bonder is currently in building 346 Phoenex lab.</span>


The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
 
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''


'''The user manual(s), user APV(s) and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
<br clear=all>


<!-- == Process information ==
=Equipment performance and process related parameters=
 
*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
-->


==Equipment performance and process related parameters==
[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]
<br clear=all>


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>TPT Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder K&S 4524</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested)
* Au ribbon (100x20µm) bonding<br />
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Au 25µm wire bonding
*Au 25µm wire bonding
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|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Manual operation
*Manual operation
*Wedge bonding:  
*Wedge bonding:  
**recommended min. bonding area 200 µm
**recommended min. bonding area 200 µm x 200 µm
*Ball bonding:   
*Ball bonding:   
**recommended min. bonding area 200 µm
**recommended min. bonding area 200 µm x 200 µm
**recommended temperature 120 <sup>o</sup>C.
**recommended temperature 120 <sup>o</sup>C.
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Semi-automatic and manual operation
*Semi-automatic and manual operation
*Bond placement laser pointer
*Bond placement laser pointer
*recommended min. bonding area 100 µm
*recommended min. bonding area 100 µm x 100 µm
*recommended temperature 120 <sup>o</sup>C.
*recommended temperature 120 <sup>o</sup>C.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center"|Substrates
|style="background:LightGrey; color:black"|Allowed materials
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*Should be able to withstand the wire bonding temperature
*Should be able to withstand the wire bonding temperature
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