Specific Process Knowledge/Characterization/Particle Scanner Takano: Difference between revisions

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-=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|550px]]=
+=Takano WM-7SR Wafer Surface Analyzer=
+<i> Unless otherwise stated, this page is written by Patama Pholprasit DTU Nanolab internal</b></i>
+The Takano WM-7SR wafer surface analyzer is being used to analyze unpatterned surfaces on wafers for particles.
+The instrument detects, counts and sizes defects on wafers with semiconductor substrate materials. The instrument uses a 405 nm laser beam which is scanning over the wafer surface to detect defect contamination, i.e. particles. When the laser beam hits a particle, it will scatter and be detected.
+The scan results are displayed in color-coded wafer maps, histograms and summaries.
+[[File:IMG 9822.JPG|350px|right|thumb|Takano tool at DTU Nanolab. Photo by Patama Pholprasit, DTU Nanolab.]]
+===Specifications===
+- Particles having a size between 79 nm um and 5 um can be detected. The minimum particle size can only be detected on smooth surfaces such as bare silicon wafers or wafers with thermal SiO2.<br />
+- The detected particles sizes depends on the used gain setting.<br />
+- Wafer cassettes are available for 4”, 6” and 8” wafers. For the 4” wafer cassette, an adapter has to be mounted on the indexer.<br />
+- The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br />
+- Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br />
+'''The user manual, technical information and contact information can be found in LabManager:'''
+'''[https://labmanager.dtu.dk/function.php?module=Machine&view=view&page_id=169 Particle Scanner Takano]'''
+[[media:Comparing Takano and SurfScan.pptx|'''Comparing Takano and SurfScan''']]