Specific Process Knowledge/Etch/Titanium Oxide: Difference between revisions
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Etch of Titanium oxide has been test in the ICP metal etcher. | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Titanium_Oxide click here]''' | ||
<!-- Page reviewed 9/8-2022 jmli --> | |||
==Etch of Titanium oxide has been test in the ICP metal etcher. == | |||
*[[/ICP metal|Titanium Oxide etch using ICP metal]] | *[[/ICP metal|Titanium Oxide etch using ICP metal]] | ||
*Titanium Oxide etch using BHF | |||
==Comparison of Titanium Oxide (ALD) etch Methods == | |||
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|-style="background:silver; color:black" | |||
! | |||
!BHF | |||
!ICP Metal Etcher | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Generel description | |||
|Wet etch of TiO2 (ALD) | |||
|Dry etch of TiO2 | |||
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|-style="background:LightGrey; color:black" | |||
!Etch rate range | |||
|2,5 nm/min | |||
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*It has not been explored | |||
*current recipe ~8 nm/min | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Etch profile | |||
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*Isotropic | |||
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*Anisotropic | |||
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|-style="background:LightGrey; color:black" | |||
!Substrate size | |||
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* | |||
*Any size (in beaker) | |||
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*Samples < 150 mm wafers on carrier | |||
*one 150 mm wafer at a time | |||
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|-style="background:WhiteSmoke; color:black" | |||
!'''Allowed materials''' | |||
|In beaker: | |||
*Any material | |||
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*silicon, silicon oxides and nitrides | |||
*Al, Cr, Ti (incl. oxides and nitrides) | |||
*Ta, W, Nb (incl. oxides and nitrides) | |||
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