Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch: Difference between revisions
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'''Feedback to this page''': '''[mailto:plasma@ | '''Feedback to this page''': '''[mailto:plasma@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE%E2%81%84IBSD_Ionfab_300/IBE_magnetic_stack_etch click here]''' | ||
<br> '''''The work on this page was done Kristian Hagsted Rasmussen, DTU Nanolab, unless otherwise stated''''' | |||
=Etching magnetic stacks= | =Etching magnetic stacks= | ||
Magnetic stacks can be etched or more precisly milled in the Ion Beam Etcher (IBE). Below is presented some work done on milling stacks of magnetic layers. | Magnetic stacks can be etched or more precisly milled in the Ion Beam Etcher (IBE). Below is presented some work done on milling stacks of magnetic layers. | ||
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===Some SEM profile images of the etched stacks=== | ===Some SEM profile images of the etched stacks=== | ||
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===Problems with resists stripping after etching=== | ===Problems with resists stripping after etching=== | ||
Resist stripping after the etch can be hard due to burned resist, to remedy this try to lower the current. Changing the | Resist stripping after the etch can be hard due to burned resist, to remedy this try to lower the current. Changing the current will change the sidewall angle and new studies of etch profiles will be necessary. For help, discussion and further info please contact the dry etch group [mailto:dryetch@nanolab.dtu.dk]. | ||
===Design of Experiment results=== | ===Design of Experiment results=== | ||