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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DryEtchProcessing click here]'''
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= Techniques, hardware and challenges common to all dry etch tools =
= Techniques, hardware and challenges common to all dry etch tools =


This page contains information that is common to dry etch instruments.  
This page contains information that is common to dry etch instruments.  


{|  border ="0" align="left" valign="top"   
{|  border ="0" align="left" valign="top"   
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|-
|-
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| style="background:#DCDCDC;"| Comparison of the different hardware setups
| style="background:#DCDCDC;"| Comparison of the different hardware setups of our dry etchers
|-
|-
| style="background: LightGray"| [[/Bonding| Temporary bonding]]
| style="background: LightGray"| [[/Bonding| Using carrier wafer]]
| style="background: #DCDCDC"| Processing different sizes of substrates by bonding to carriers
| style="background: #DCDCDC"| Processing different sizes of substrates by using a carriers: bonding or not bonding
|-
|-
| style="background: LightGray"| [[/OES| Optical Endpoint System]]
| style="background: LightGray"| [[/OES| Optical Endpoint System]]
| style="background: #DCDCDC"| Using the OES technique to find endpoints and to diagnose plasmas
| style="background: #DCDCDC"| Using the OES technique to find endpoints and to diagnose plasmas
|-
|-
 
| style="background: LightGray"| [[/LEP| LASER Endpoint System]]
| style="background: #DCDCDC"| Using the LEP technique to find endpoints between interfaces or at a etch depth (in transparent layers)
|-
| style="background: LightGray"| [[/Data4dryetch| Etch product volatility]]
| style="background: #DCDCDC"| Links to various tables with data on etch product volatility
|-
|}
|}
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