Specific Process Knowledge/Etch/DRIE-Pegasus/processB: Difference between revisions
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== Process B == | == Process B == | ||
Process B | Process B was run on a 150 mm wafer with 12-13 % etch load. | ||
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=== Results === | === Results === | ||
A number of wafers are patterned with the [[Specific Process Knowledge/ | A number of wafers are patterned with the [[Specific Process Knowledge/Pattern Design/Travka|Travka mask set]] in 4 microns of AZ photoresist. The wafers are then etched using two different durations of process B in the DRIE-Pegasus. | ||
{| | |||
| STYLE="vertical-align: top"| | |||
{| border = 1 | |||
|+ '''Wafers''' | |||
|- | |||
! width="70" |Wafer number | |||
! width="70" |Mask | |||
! Process B duration | |||
|- | |||
| 2 | |||
| Travka 05 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 3 | |||
| Travka 05 | |||
| 34 cycles, 6:14 mins | |||
|- | |||
| 5 | |||
| Travka 10 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 6 | |||
| Travka 10 | |||
| 34 cycles, 6:14 mins | |||
|- | |||
| 8 | |||
| Travka 20 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 9 | |||
| Travka 20 | |||
| 34 cycles, 6:14 mins | |||
|} | |||
| STYLE="vertical-align: top"| | |||
{| border = 1 | |||
|+ '''Wafers''' | |||
|- | |||
! width="70" |Wafer number | |||
! width="70" |Mask | |||
! Process B duration | |||
|- | |||
| 11 | |||
| Travka 35 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 12 | |||
| Travka 35 | |||
| 34 cycles, 6:14 mins | |||
|- | |||
| 14 | |||
| Travka 50 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 15 | |||
| Travka 50 | |||
| 34 cycles, 6:14 mins | |||
|- | |||
| 17 | |||
| Travka 65 | |||
| 17 cycles, 3:07 mins | |||
|- | |||
| 18 | |||
| Travka 65 | |||
| 34 cycles, 6:14 mins | |||
|} | |||
|} | |||
After etching each wafer is cleaved in two places: Both cleavage lines run across the [[Specific Process Knowledge/Pattern Design/Travka/fields/Aline|A-line fields]]. This produces three sites on each wafer where the depth of the trenches can be determined using an SEM. | |||
<gallery caption="The results of | <gallery caption="The results of process B after 17 and 34 cycles of etching" widths="500" heights="350" perrow="2"> | ||
image:Travkatesting1a.jpg| | image:Travkatesting1a.jpg| | ||
image:Travkatesting1b.jpg| | image:Travkatesting1b.jpg| | ||
</gallery> | </gallery> | ||