Specific Process Knowledge/Etch/OES: Difference between revisions
No edit summary |
|||
| (7 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
{{Contentbydryetch}} | |||
<!-- Page reviewed 28/6-2023 jmli --> | |||
<!--Checked for updates on 4/9-2025 - ok/jmli --> | |||
=Optical endpoint detection on the dry etch tools at DTU Nanolab= | =Optical endpoint detection on the dry etch tools at DTU Nanolab= | ||
Several dry etch tools at DTU Nanolab are equipped with an endpoint detection system. Out of those systems only one is not of the type optical endpoint detection. The instruments are: | Several dry etch tools at DTU Nanolab are equipped with an endpoint detection system. Out of those systems only one is not of the type optical endpoint detection. The instruments are: | ||
| Line 4: | Line 9: | ||
* III-V ICP | * III-V ICP | ||
* Pegasus 1 | * Pegasus 1 | ||
* Pegasus 2 | |||
* Pegasus 4 | * Pegasus 4 | ||
The section below describes the principle behind the optical endpoint detection system. | The section below describes the principle behind the optical endpoint detection system. | ||
| Line 19: | Line 25: | ||
'''Example: The etching of silicon by fluorine:'''<br> | '''Example: The etching of silicon by fluorine:'''<br> | ||
The table below contains the most important emission lines for some of the species in dry etching. | |||
{| border="2" cellspacing="1" cellpadding="1" | {| border="2" cellspacing="1" cellpadding="1" | ||
| align="center" style="background:#f0f0f0;"|'''Monitored species''' | | align="center" style="background:#f0f0f0;"|'''Monitored species''' | ||
| align="center" style="background:#f0f0f0;" width="120px"|'''Wavelength (nm)''' | | align="center" style="background:#f0f0f0;" width="120px"|'''Wavelength (nm)''' | ||
| | | width="20"| | ||
| align="center" style="background:#f0f0f0;"|'''Monitored species''' | | align="center" style="background:#f0f0f0;"|'''Monitored species''' | ||
| align="center" style="background:#f0f0f0;" width="120px"|'''Wavelength (nm)''' | | align="center" style="background:#f0f0f0;" width="120px"|'''Wavelength (nm)''' | ||
| Line 74: | Line 59: | ||
|- | |- | ||
|} | |} | ||
'''SpectraView:'''<br> | |||
At the center of the SpectraView software is the configuration file (*.svc file) that dictates what to be done. | |||
Below is a figure | |||
[[file:image010.jpg |1500px|frameless ]] | |||
== Process considerations == | |||
'''The intensity of the light:'''<br> | |||
The intensity of the light will depend on whether the molecule is a reactant or an etch product: | |||
# Reactant: The concentration in the plasma: | |||
## The carrier gas flow rate | |||
## The RF power (both coil and platen) | |||
## The process pressure | |||
# Etch product: | |||