Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
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{{Author-jmli1}} | |||
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= Process optimization using the Picoscope = | = Process optimization using the Picoscope = | ||
Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done. | Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done. | ||
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=== Process D4 === | === Process D4 === | ||
After a few years in its original configuration, we decided to | After a few years in its original configuration, we decided to [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|'''upgrade Pegasus 1''']] to improve the fast switching performance. As a result, the original recipe Process D was changed to Process D4 with faster cycles. The process parameters are listed in the table below. | ||
{| {{table}} | {| {{table}} | ||
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* Collection time, red frame: Here, it is 5 seconds per division, can also be 10 seconds per division | * Collection time, red frame: Here, it is 5 seconds per division, can also be 10 seconds per division | ||
* Number of samples, green frame: The lowest sampling rate (50 S) is still much, much faster than the SPTS Pro software. | * Number of samples, green frame: The lowest sampling rate (50 S) is still much, much faster than the SPTS Pro software. | ||
* Waveform Buffer Index, blue frame: The number of screens with data in the current recording. If stopped, scroll back and forth by pressing the Next and Previous buttons. | * Waveform Buffer Index, blue frame: The number of screens with data in the current recording. If stopped, scroll back and forth by pressing the Next and Previous buttons (blue triangular buttons behind the blue frame). | ||
[[image:picodut.PNG |400px]] | [[image:picodut.PNG |400px]] | ||
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== Optimizing recipes with Picoscope == | == Optimizing recipes with Picoscope == | ||
Continuous processes do not benefit from the Picoscope in the same way that Bosch processes do. This is why a Picoscope has not been installed on Pegasus | Continuous processes do not benefit from the Picoscope in the same way that Bosch processes do. This is why a Picoscope has not been installed on Pegasus 4 that runs continuous etch processes of dielectrics. For the Bosch processes, however, the situation is different. Optimizing multiplexed processes without the Picoscope now feels somewhat like studying the night sky with the naked eye compared to using a telescope. So many details in the etch processes are invisible without the Picoscope that it becomes meaningless to optimize Bosch processes without it. | ||
The downside of having a much more detailed view of the process is that it is very time consuming to arrive a minimum of reflected powers. Small changes in setpoints of the matching units can have dramatic impact. Quite often it is necessary to introduce shoulders on changes in gas flows to soften the transition in plasma conditions. As a result, the number of necessary parameters in the recipes increases a lot. Below is a few variation of the socalled DREM (see publications in the list below) recipes. All RF matching setpoints are as important as any other parameter. | The downside of having a much more detailed view of the process is that it is very time consuming to arrive a minimum of reflected powers. Small changes in setpoints of the matching units can have dramatic impact. Quite often it is necessary to introduce shoulders on changes in gas flows to soften the transition in plasma conditions. As a result, the number of necessary parameters in the recipes increases a lot. Below is a few variation of the socalled DREM (see publications in the list below) recipes. All RF matching setpoints are as important as any other parameter. | ||
{{Template: | {{Template:Peg1RecipeTableVerCColors | ||
|TableHeader=Variations of the DREM 3kW recipe | |TableHeader=Variations of the DREM 3kW recipe | ||
}} | }} | ||
{{Template: | {{Template:Peg1RecipeTableVerCAddrowColors | ||
|RecipeName=DREM 3kW 100% | |RecipeName=DREM 3kW 100% | ||
|PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | |PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | ||
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|SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | |SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | ||
|SF6EtchDelay=1.1@15 |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | |SF6EtchDelay=1.1@15 |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | ||
|ArDep=200 |ArEtch=3@250,250 | |||
|WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | |WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | ||
|WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost=05@300 |WPlatenEtchMain=0.1 | |WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost=05@300 |WPlatenEtchMain=0.1 | ||
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|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 3kW 100% | '''1''']] | |Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 3kW 100% | '''1''']] | ||
}} | }} | ||
{{Template: | {{Template:Peg1RecipeTableVerCAddrowColors | ||
|RecipeName=DREM 3kW 100% a | |RecipeName=DREM 3kW 100% a | ||
|PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | |PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | ||
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|SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | |SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | ||
|SF6EtchDelay='''1.2@15''' |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | |SF6EtchDelay='''1.2@15''' |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | ||
|ArDep=200 |ArEtch=3@250,250 | |||
|WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | |WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | ||
|WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost='''0.6@300''' |WPlatenEtchMain=0.1 | |WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost='''0.6@300''' |WPlatenEtchMain=0.1 | ||
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|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 3kW 100% a| '''1''']] | |Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 3kW 100% a| '''1''']] | ||
}} | }} | ||
{{Template: | {{Template:Peg1RecipeTableVerCAddrowColors | ||
|RecipeName=DREM 3kW 100% b | |RecipeName=DREM 3kW 100% b | ||
|PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | |PriorProcessSteps= Pump to base, Clamp Substrate, preset matching unit step | ||
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|SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | |SF6DepDelay=0.3@200 |SF6DepBoost= |SF6DepMain=15 | ||
|SF6EtchDelay=1.2@15 |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | |SF6EtchDelay=1.2@15 |SF6EtchBoost=0.3@200 |SF6EtchMain=900 | ||
|ArDep=200 |ArEtch=3@250,250 | |||
|WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | |WCoilDep=3 |WCoilEtch=3 |WPlatenDep=0 | ||
|WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost=0.6@300 |WPlatenEtchMain=0.1 | |WPlatenEtchDelay=0.6@1 |WPlatenEtchBoost=0.6@300 |WPlatenEtchMain=0.1 | ||
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It was professor [https://www.dtu.dk/service/telefonbog/person?id=103402&cpid=191195&tab=1 Henri Jansen] at DTU Nanolab who came up with the idea of adding the Picoscope to the Pegasi tools. Since then his group has researched a lot into its possibilities. Below is a list of publications in which the Picoscope plays a crucial role: | It was professor [https://www.dtu.dk/service/telefonbog/person?id=103402&cpid=191195&tab=1 Henri Jansen] at DTU Nanolab who came up with the idea of adding the Picoscope to the Pegasi tools. Since then his group has researched a lot into its possibilities. Below is a list of publications in which the Picoscope plays a crucial role: | ||
; Bingdong Chang et al.: DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process | |||
: 2018 Microelectronic Engineering Volume 191, 5 May, Pages 77-83 | |||
: https://doi.org/10.1016/j.mee.2018.01.034 | |||
; Bingdong Chang et al.: DREM2: A facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process | |||
: 2018 J. Micromech. Microeng. 28 105012 | |||
: https://doi.org/10.1088/1361-6439/aad0c4 | |||
; Vy Thi Hoang Nguyen et al.: The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature | |||
: 2020 ECS J. Solid State Sci. Technol. 9 024002 | |||
: https://doi.org/10.1149/2162-8777/ab61ed | |||
; Bingdong Chang et al.: Large Area Three-Dimensional Photonic Crystal Membranes: Single-Run Fabrication and Applications with Embedded Planar Defects | |||
: 2019, Advanced Optical Materials Volume 7, Issue 2, pp. 1801176 | |||
: https://doi.org/10.1002/adom.201801176 | |||
; Chantal Silvestre et al.: Deep reactive ion etching of ‘grass-free’ widely-spaced periodic 2D arrays, using sacrificial structures | |||
: 2020, Microelectronic Engineering, Volume 223, 15 February, 111228 | |||
: https://doi.org/10.1016/j.mee.2020.111228 | |||