Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions
Created page with "== Temporary bonding of wafers or chips for dry etching == === Purpose === Many tools are set up for processing one particular size of wafer. The reasons why a tool processe..." |
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== Temporary bonding of | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding click here]''' | ||
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{{Template:Contentbydryetch}} | |||
== Carriers for dry etching: Temporary bonding of samples or carriers for none bonded samples == | |||
<!--Checked for updates on 3/2-2023 - ok/jmli --> | |||
=== Purpose === | === Purpose === | ||
The dry etch tools are set up for processing one particular size of wafer. The reasons why a tool processes one size of wafers and not others are numerous - they may include: | |||
* Hardware availability | * Hardware availability | ||
* Processes required by users | * Processes required by users | ||
The dry etch tools at | The dry etch tools at Nanolab all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will require the use of a carrier wafer. Using a carrier is also often required if the side of the wafer facing the electrode has structures. | ||
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ ''' | |+ '''Processing different sizes of wafers or chips in the dry etch tools at Nanolab ''' | ||
|- | |- | ||
! Tool | ! Tool | ||
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! Sizes of wafers or chips that may bonded and processed | ! Sizes of wafers or chips that may bonded and processed | ||
|- | |- | ||
![[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus]] | ![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus-1]] | ||
| 4" wafer | | 4" wafer | ||
| 6" wafer | | 6" wafer | ||
| Samples smaller than a 4" wafer | | Samples smaller than a 4" wafer | ||
|- | |- | ||
![[Specific Process Knowledge/Etch/ | ![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2|DRIE-Pegasus-2]] | ||
| 6" wafer | |||
| 4" wafer | | 4" wafer | ||
| Samples smaller than a 6" wafer | |||
| Samples smaller than a | |||
|- | |- | ||
![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ||
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=== Procedures === | === Procedures === | ||
====Making Carrier with capton(polyimide) tape==== | |||
If you do not want to bond your sample to the carrier you can make a carrier wafer by adding pieces of capton tape on the carrier wafer to avoid the sample to slide off the carrier inside the chamber. You have to follow this procedure to keep the carrier clean. | |||
[[:file:Making carrier with capton tape.docx]] | |||
==== Bonding ==== | ==== Bonding ==== | ||
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<ol> | <ol> | ||
<li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li> | <li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li> | ||
<li>Take a piece of crystalbond from the shelf in cleanroom 1. </li> | <li>Take a piece of crystalbond from the shelf in cleanroom A-1. </li> | ||
<li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom 1. </li> | <li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom C-1. </li> | ||
[[image:bonding-n01x.jpg]] | [[image:bonding-n01x.jpg]] | ||
<li>Put the carrier wafer on the hotplate. A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. </li> | <li>Put the carrier wafer on the hotplate. <!-- A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. --> </li> | ||
<li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li> | <li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li> | ||
<li>Gently put your wafer on the crystalbond. </li> | <li>Gently put your wafer on the crystalbond. </li> | ||