Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions
No edit summary |
|||
| (11 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]''' | ||
<!--Checked for updates on 14/5-2018 - ok/jmli --> | <!--Checked for updates on 14/5-2018 - ok/jmli --> | ||
<!-- Page reviewed 9/8-2022 jmli --> | |||
<!--Checked for updates on 4/9-2025 - ok/jmli --> | |||
= Modification of showerhead in december 2014 = | = Modification of showerhead on Pegasus 1 in december 2014 = | ||
This page describes why the showerhead has been changed and what process changes have been found | {{Template:Author-jmli1}} | ||
<!--Checked for updates on 2/02-2023 - ok/jmli --> | |||
This page describes why the showerhead has been changed and what process changes have been found. | |||
== Motivation == | == Motivation == | ||
The showerhead that distributes the process gasses inside the plasma source was changed. In the old design, the showerhead had a number of | The showerhead that distributes the process gasses inside the Pegasus plasma source was changed. In the old design, the showerhead had a number of holes intended to distribute the gas uniformly inside the plasma source. The passage through the holes had a flow resistance that would cause the gasses coming from the MFC in a Bosch process to get mixed up - in this way working against the separation of the etch and dep cycles. | ||
This modification | In the new design, the gas flow resistance has been reduced by increasing the diameter holes in the showerhead instead. This has no impact on processes that have a continuous gas flow - i.e. processes that are not switched. However, for processes with several gas flows that switch on and off, the switching from one gas flow to another will be much more well defined. This has enabled us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness and better control. We have not seen any changes to the uniformity of the plasma nor any other side effect. The modification was also done on Pegasus 2 and 3 before we started using them. | ||
== Comparison of continuous processes == | == Comparison of continuous processes on Pegasus 1== | ||
=== Black silicon recipe === | === Black silicon recipe === | ||
| Line 52: | Line 55: | ||
|} | |} | ||
== Comparison of switched processes == | == Comparison of switched processes on Pegasus 1== | ||