Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/ICP_Metal_Etcher click here]''' | ||
<!--Page reviewed by jmli 9/8-2022 --> | |||
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[[Category: Equipment |Etch ICP Metal]] | [[Category: Equipment |Etch ICP Metal]] | ||
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== The ICP Metal Etcher == | == The ICP Metal Etcher == | ||
[[Image:ICP-Metal-Etcher.jpg |300x300px|thumb|The SPTS ICP Metal Etcher in the | [[Image:ICP-Metal-Etcher.jpg |300x300px|thumb|The SPTS ICP Metal Etcher in the DTU Nanolab cleanroom B-1]] | ||
Name: PRO ICP <br> | |||
Vendor: STS (now SPTS) <br> | |||
The ICP Metal Etcher allows you to dry etch a small set of metals that includes aluminium, titanium, chromium, titanium tungsten and molybdenum (along with the related oxides and nitrides). It is, despite its name, strictly forbidden to etch (or expose to plasma) other metals. In order to do so use the [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]]. | The ICP Metal Etcher allows you to dry etch a small set of metals that includes aluminium, titanium, chromium, titanium tungsten and molybdenum (along with the related oxides and nitrides). It is, despite its name, strictly forbidden to etch (or expose to plasma) other metals. In order to do so use the [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]]. | ||
'''The user manual, user APV and contact information can be found in LabManager:''' | '''The user manual, user APV and contact information can be found in LabManager:''' | ||
Equipment info in [http://labmanager | Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=266 LabManager] | ||
==Process information== | ==Process information== | ||
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*[[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon nitride|Etch of silicon nitride]] | *[[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon nitride|Etch of silicon nitride]] | ||
*[[Specific Process Knowledge/Etch/Titanium Oxide/ICP metal|Etch of Titanium Oxide]] | *[[Specific Process Knowledge/Etch/Titanium Oxide/ICP metal|Etch of Titanium Oxide]] | ||
*[[Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal| | *[[Specific Process Knowledge/Etch/Titanium Nitride/ICP metal|Etch of Titanium Nitride]] | ||
*[[Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal|Al<sub>2</sub>O<sub>3</sub> Etch]] | |||
'''End point detection''' | |||
*[[/Examples of End point detection|Examples of End point detection]] | |||
==An overview of the performance of the ICP Metal Etcher and some process related parameters== | ==An overview of the performance of the ICP Metal Etcher and some process related parameters== | ||
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|- | |- | ||
| C<sub>4</sub>F<sub>8</sub>: 0-100 sccm | | C<sub>4</sub>F<sub>8</sub>: 0-100 sccm | ||
| Ar: 0- | | Ar: 0-300 sccm | ||
|- | |- | ||
| CF<sub>4</sub>: 0-100 sccm | | CF<sub>4</sub>: 0-100 sccm | ||