Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano: Difference between revisions
No edit summary |
|||
| (18 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/silicon/nano click here]''' | |||
<!--Checked for updates on 30/7-2018 - ok/jmli --> | |||
<!--Checked for updates on 5/10-2020 - ok/jmli --> | |||
<!--Checked for updates on 4/9-2025 - ok/jmli --> | |||
== Etching of nanostructures in silicon == | == Etching of nanostructures in silicon == | ||
{{Template:Author-jmli1}} | |||
<!--Checked for updates on 2/02-2023 - ok/jmli --> | |||
A series of experiments with etching nanostructures in silicon has been carried out. The common process parameters are: | A series of experiments with etching nanostructures in silicon has been carried out. The common process parameters are: | ||
| Line 18: | Line 25: | ||
{| border="2" cellspacing="1" cellpadding="3" style="text-align:center;" | {| border="2" cellspacing="1" cellpadding="3" style="text-align:center;" | ||
!Recipe Sinano | !Recipe Sinano | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano3|3.0]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano3|3.0]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano31|3.1]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano31|3.1]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano32|3.2]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano32|3.2]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan33|3.3]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan33|3.3]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano34|3.4]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano34|3.4]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano4|4.0]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano4|4.0]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano35|3.5]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano35|3.5]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano36|3.6]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinano36|3.6]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan33-2|3.3]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan33-2|3.3]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan37|3.7]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan37|3.7]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan331|3.31]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan331|3.31]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan331-2|3.31]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan331-2|3.31]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan332|3.32]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan332|3.32]] | ||
|- | |- | ||
!Cl<sub>2</sub> (sccm) | !Cl<sub>2</sub> (sccm) | ||