Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions

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-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''
-<!--Checked for updates on 2/2-2016 - ok/jmli -->
+<!--Checked for updates on 30/7-2018 - ok/jmli -->
+<!--Checked for updates on 5/10-2020 - ok/jmli -->
+<!--Checked for updates on 4/9-2025 - ok/jmli -->
+== Development of continuous nanoetch ==
+{{Template:Author-jmli1}}
+<!--Checked for updates on 2/02-2023 - ok/jmli -->
-== Development of continuous nanoetch ==
+The recipes below have been run on 2" wafers with 30/60/90/120/150 nm lines in zep resist. The wafers were crystalbonded to a 4" oxide carrier leaving only a very small fraction (much less than 1% ) of silicon to be etched. If you intend to etch most of the surface of the wafer to create very small posts or ridges (rather than holes or trenches)
-The recipes below have been run on 2" wafers with 30/60/90/120/150 nm lines in zep resist. The wafers were crystalbonded to a 4" oxide carrier leaving only a very small fraction (much less than 1% )of silicon to be etched. The most used one is the nano1.42 recipe - to access the results, click on the bold link in the bottom of the table.
+The most used one is the nano1.42 recipe - to access the results, click on the bold link in the bottom of the table.