Jump to content

Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

Reet (talk | contribs)
Reet (talk | contribs)
 
(One intermediate revision by the same user not shown)
Line 58: Line 58:
[[/Ion source in E-beam evaporator (Temescal)|Information on the ion source]].
[[/Ion source in E-beam evaporator (Temescal)|Information on the ion source]].


==Equipment performance and process related parameters for the Temescal E-beam evaporator==
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
Line 112: Line 112:
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
*Almost any that does not outgas and is approved in the cleanroom.
*Quartz wafers
*Pyrex wafers
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]  
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]  
|-  
|-  
| style="background:LightGrey; color:black"|Material allowed on the substrate
| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon oxide
*Almost any that does not outgas and is approved in the cleanroom.
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|-  
|-