Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions

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-==EVG NIL==
+{{cc-nanolab}}
-[[Image:EVG NIL.jpg|200 × 200px|thumb|right|The EVG NIL is positioned in Cleanroom 4.]]
-'''Feedback to this section''':
+'''Feedback to this section''': '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''
-'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# EVG NIL click here]'''
-The EVG NIL is a system for imprinting in polymers (Hot Embossing), and for bonding on wafer scale. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult.
+==Imprinter 01==
-It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen.
+[[Image:imprinterfig1.jpg|300x300px|thumb|Imprinter 01: Positioned in cleanroom F-2]]
+The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).
-'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 LabManager]'''
+'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=391 LabManager]'''
 <br clear="all" />
+====Imprint information====
+*[[Specific Process Knowledge/Imprinting|Imprinting]]
+<br clear="all" />
+<br clear="all" />
+====Imprint resist information and process flows====
+*[[Specific Process Knowledge/Imprinting|Imprinting]]
+<br clear="all" />
+==Overview of the performance of the Imprinter 01 and some process related parameters==
+{| border="2" cellspacing="0" cellpadding="10"
+|-
+!style="background:silver; color:black;" align="left"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*Imprinting
+|-
+!style="background:silver; color:black" align="left"|Performance
+|style="background:LightGrey; color:black"|Alignment accuracy
+|style="background:WhiteSmoke; color:black"|
+*Only by eye
+|-
+|-
+!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
+|style="background:LightGrey; color:black"|Process Temperature
+|style="background:WhiteSmoke; color:black"|
+*Room temperature to 200°C
+|-
+|style="background:LightGrey; color:black"|Process pressure
+|style="background:WhiteSmoke; color:black"|
+*~5<math>\cdot</math>1mbar - atm
+|-
+|style="background:LightGrey; color:black"|Imprint Pressure
+|style="background:WhiteSmoke; color:black"|
+*0-6 bar
+|-
+!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Batch size
+|style="background:WhiteSmoke; color:black"|
+*Pieces to 4" wafers
+|-
+| style="background:LightGrey; color:black"|Substrate material allowed
+|style="background:WhiteSmoke; color:black"|
+*Silicon
+*Quartz
+*Pyrex
+|-
+| style="background:LightGrey; color:black"|Material allowed on the substrate
+|style="background:WhiteSmoke; color:black"|
+*Silicon oxide
+*Silicon (oxy)nitride
+*Poly Silicon
+*Photoresist
+*PMMA
+*TOPAS
+*SU-8
+*Metals: Au, Sn, Ag, Al, Ti.
+|-
+|}