Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

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Substrates coated with resists are mounted in a cassette and transferred into the e-beam writer via the robot loader (autoloader). Even fully trained users are only authorized to mount substrates into the e-beam cassettes but '''not''' authorized to load the cassettes into the autoloader.

If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.

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The computer controlling the e-beam (EWS/9500) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.

 

There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a BEAMER manual. They can all 3 be accessed from LabAdviser or from LabManager under Technical documents.

 

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| chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down

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1. Carefully position the cassette face down on the optical aligner stage; make sure that the cassette is completely aligned with the stage before clamping the cassette to the stage. The hook of the cassette should turn away from yourself, i.e. towards the wall.

3. Turn on the yellow light. Align the stage to the zero-marker, and press x and y on the sensor controller. This zeros the position of the software according to zero of the stage. Always zero the stage at maximum magnification.

4. In PAMS, choose JBX-9300FS and correct wafer size and position in the workpiece window. Enter the P and Q mark design positions (i.e. L-edit coordinates).

5. Find the P mark at maximum magnification. Click ‘Get P’. Repeat the procedure with the Q mark. Calculate gain and rotation by clicking 'Calculate' and log the results in the Log-window by clicking 'Log result'. Switch off the yellow light after use.

6. Save the alignment information (File/Save). The file should be saved under your name and date, eg ‘mettekjan312012.txt’, in the folder ‘C:\temp’. This file can be transferred to the e-beam computer DCH1352 by email or dropbox.

7. In the jdf-file, the theoretical (L-edit/CleWin) position of the P and Q marks should be defined. In the sdf-file the mark-detection should be set to semi-automatic 'S' (see section 7 in this manual and the separate sdf- and jdf-file preparation manual).

For safety reasons, users are only authorized to unload cassettes from the autoloader and to load empty cassettes into the autoloader.  

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| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark is '''not''' recommended || Fabricate 2 or 3 P and Q marks. Place the P marks on the left side of the wafer and Q marks to the right. Do not place the marks closer than 15 mm to the edges of the wafer.|| Example of chip with 4 chip marks. Always position the chip marks outside the chip pattern. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0).

*enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.

== Subprogram that detcets chip marks: CHIPAL ==

|SFOCUS uses the bottom AE mark to measure the beam diameter while adjusting the objective lens. The objective lens is defined to be in focus where the machine finds the minimum beam diameter. This program can also be used to observe the depth of focus of a certain condition file. The graph shows the beam diameter versus position of objective lens. The position of the objective lens is converted to a difference in substrate height by executing the subprogram 'HCOEFFI'. <br><br> Please note, that SFOCUS does not work well for currents larger than 6 nA; at higher currents the focus should be set manually. This is to be done by DTU Danchip staff only.