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DTU Nanolab has two EBL exposure systems, a JEOL JBX-9500FSZ and a Raith eLINE Plus system. The two systems are very different and new users should consult the EBL team to dertermine which system is appropriate for a particular project or type of sample. The general specifications of the two tools are given in the table below and may serve as a guideline for choice of system to use, especially the pros and cons list at the end of the table.
DTU Nanolab has two EBL exposure systems, a JEOL JBX-9500FSZ and a Raith eLINE Plus system. The two systems are very different and new users should consult the EBL team to dertermine which system is appropriate for a particular project or type of sample. The general specifications of the two tools are given in the table below and may serve as a guideline for choice of system to use, especially the pros and cons list at the end of the table.
For more information and specific workflows on either tool, please refer to their respective pages; [[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ|JEOL JBX-9500FSZ]] or [[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith eLINE Plus]].




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|[[media:Process_Flow_ZEP.docx|Process Flow ZEP]]




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|Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx‎|Process_Flow_Trilayer_Ebeam_Resist.docx‎]]
|Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx‎|Process Flow]]


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|[[media:Process_Flow_mrEBL6000.docx‎|Process Flow‎]]


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|[[media:Process Flow HSQ.docx|process flow HSQ]]
|[[media:Process Flow HSQ.docx|process flow HSQ]]
[[/High resolution patterning with HSQ|High resolution patterning with HSQ]]
[[/Lithography/EBeamLithography/High resolution patterning with HSQ|High resolution patterning with HSQ]]


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The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]].
The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]].
If your process can not utilize a aluminum discharge layer, Espacer might be another possibility to pursue. Espacer is a chemical that works as a discharging layer; it is spun onto the wafer on top of the resist and easily rinsed off the wafer after e-beam exposure. Visit this page for more information: [[Specific_Process_Knowledge/Lithography/Espacer|Espacer]]


= Literature on E-beam Lithography =
= Literature on E-beam Lithography =
* Lithography, Wiley, 2011: Chapter 3, Electron Beam Lithography by Stefan Landis: http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary
* Lithography, Wiley, 2011: Chapter 3, Electron Beam Lithography by Stefan Landis: http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary
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