Specific Process Knowledge/Thin film deposition/Antistiction Coating: Difference between revisions
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== Processing on the MVD == | == Processing on the MVD == | ||
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These chemicals, typically flourinated organosilanes, have a teflon-like tail consisting of -(CF<sub>2</sub>)<sub>x</sub>CF<sub>3</sub> and, in the other end, a reactive group -Si<sub>(teflon)</sub>Cl<sub>x</sub>. As shown in the figure below, the chlorine atoms react with Si<sub>(surface)</sub>-OH groups of the surface to form a chemical bond -Si(<sub>(teflon)</sub>)-O-Si<sub>(surface)</sub>- under elimination of HCL. This means that both Si and SiO<sub>2</sub> surfaces are coated because of the native oxide on Si surfaces. | These chemicals, typically flourinated organosilanes, have a teflon-like tail consisting of -(CF<sub>2</sub>)<sub>x</sub>CF<sub>3</sub> and, in the other end, a reactive group -Si<sub>(teflon)</sub>Cl<sub>x</sub>. As shown in the figure below, the chlorine atoms react with Si<sub>(surface)</sub>-OH groups of the surface to form a chemical bond -Si(<sub>(teflon)</sub>)-O-Si<sub>(surface)</sub>- under elimination of HCL. This means that both Si and SiO<sub>2</sub> surfaces are coated because of the native oxide on Si surfaces. | ||
A picture showing some of chemicals MVD and the surface reaction can be found in LabManager [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=12&name=MVD+reaction.jpg here] (requires login). | |||
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<gallery caption="Some chemicals used in MVD and the surface reaction" widths="200px" heights="150px" perrow="2"> | <gallery caption="Some chemicals used in MVD and the surface reaction" widths="200px" heights="150px" perrow="2"> | ||
image:chlorosilanes.jpg|Different chemicals for the MVD. | image:chlorosilanes.jpg|Different chemicals for the MVD. | ||
image:MVDsurfacereaction.jpg|The chemical reaction in which the Cl atoms of the precursors are eliminated under formation of HCl. | image:MVDsurfacereaction.jpg|The chemical reaction in which the Cl atoms of the precursors are eliminated under formation of HCl. | ||
</gallery> | </gallery> | ||
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=== The parameters of the MVD process === | === The parameters of the MVD process === | ||
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It is critical that the chemicals with the lowest vapor pressure are injected first into the process chamber. If, for instance, water is injected before FDTS, the water will flow into the FTDS expansion volume and cause polymerization, thus forcing a mechanical clean. NOT GOOD!. | It is critical that the chemicals with the lowest vapor pressure are injected first into the process chamber. If, for instance, water is injected before FDTS, the water will flow into the FTDS expansion volume and cause polymerization, thus forcing a mechanical clean. NOT GOOD!. | ||
== The | == The FLAT2 recipe == | ||
=== Purpose === | === Purpose === | ||
The | The FLAT2 recipe is designed for quick coating of non-structured wafers. One should not expect to get good conformal coverage of nanostructures or nanometersized surface roughness. | ||
=== Process description === | === Process description === | ||
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== The | == The STAMP2 recipe == | ||
=== Purpose === | === Purpose === | ||
The | The STAMP2 recipe uses the same total amount of FDTS as FLAT but delivers it much slower in order to obtain a much better and conformal coating of fine nanostructures. STAMP2 should always be used for stamps for nanoimprint lithography irregardless of the feature size. | ||
=== Process description === | === Process description === | ||