Specific Process Knowledge/Thin film deposition: Difference between revisions

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+{{cc-nanolab}}
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
-<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
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 [[/Deposition of Silicon|Silicon]] <br/>
 [[/Deposition of Germanium|Germanium]] <br/>
-[[/DiamondCVD|Diamond]] <br/>
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 [[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
 [[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
+[[/Deposition of Niobium Nitride| Niobium Nitride (NbN)]] - ''superconductors''<br/>
 [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
 [[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
+[[/Deposition of Tungsten Nitride| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>
+[[/Deposition of Tantalum Nitride| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/>
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 [[/Sputter deposition of metals and alloys|FeMn]]<br/>
 [[/Sputter deposition of metals and alloys|MnIr]]<br/>
-[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
+[[/Deposition of NbTi|NbTi]] <br/>
 [[/Deposition of NiFe|NiFe]]<br/>
 [[/Deposition of NiV|NiV]] alloy <br/>
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
+[[/Deposition of MoSi|MoSi]] alloy (50%/50% by At.%) <br/>
 And an electroceramic:
 [[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
+[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]
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 *[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
 *[[/Lesker|Lesker]] - ''Sputter tool''
-*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
 *[[/thermalevaporator|Thermal evaporator]]
-*[[/Temescal|E Beam Evaporator (Temescal)]]
+*[[/Temescal|E-Beam Evaporator (Temescal)]]
+*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
 *[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
 *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
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 *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
-*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''
+<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
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 *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
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 *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
-*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
+*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
-*Electroplating of Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
+*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
-*MOCVD - Epitaxial growth - ''Ask the department of photonics if you are interested: [mailto:esem@fotonik.dtu.dk Elizaveta Semenova] or [mailto:kryv@fotonok.dtu.dk Kresten Yvind]''
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