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Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions

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'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''
'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''


[[Category: Equipment|Etch Wet Gold]]
'''Unless anything else is stated, everything on this page text and pictures are made by DTU Nanolab.'''
[[Category: Etch (Wet) bath|Gold]]
 
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
 
'''All measurements on this page has been made by Nanolab staff.'''
 
[[index.php?title=Category:Equipment|Etch Wet Gold]]
[[index.php?title=Category:Etch (Wet) bath|Gold]]


Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  
Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  
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We have two different solutions:
We have two different solutions:


# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrous oxide gases which are very toxic!!'''
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!'''




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!  
!  
! Iodine based gold etch
! Iodine based gold etch
! Aqua Regia (Kongevand)
! Aqua Regia (kongevand)
! Dilute Aqua Regia (fortyndet kongevand)
|-
|-


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!General description
!General description
|
|
Etch of pure Gold with or without photoresist mask.
Etch of gold with or without photoresist mask.
|
Etch of gold (as stripper).
|
|
Etch of pure Gold (as stripper).
Etch of gold.
|-
|-


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!Link to safety APV
!Link to safety APV
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]  
|-
|-
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|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|HCl:HNO<sub>3</sub>  (3:1)
|HCl:HNO<sub>3</sub>  (3:1)
|HCl:HNO<sub>3</sub>:H<sub>2</sub>O  (3:1:2)
|-
|-


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|-style="background:LightGrey; color:black"  
|-style="background:LightGrey; color:black"  
!Process temperature
!Process temperature
|20 <sup>o</sup>C
|20°C


|20 <sup>o</sup>C
|20°C


|20-30°C
|-
|-


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|
|
Unmasked - used as a stripper
Unmasked - used as a stripper
|
Difficult to mask. Mainly used as a stripper.
|-
|-


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|
|
~(??) nm/min - fast etch
~(??) nm/min - fast etch
|
~680 nm/min at 30°C
|-
|-


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!Batch size
!Batch size
|
|
1-5 4" wafers at a time
1-5 4" wafers at a time
|
|
1-5 4" wafer at a time
1-5 4" wafers at a time
|
1-5 4" wafers at a time
|-
|-


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|-style="background:LightGrey; color:black"  
|-style="background:LightGrey; color:black"  
!Size of substrate
!Size of substrate
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
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|
|
No restrictions when used in beaker.
No restrictions when used in beaker.
Make a note on the beaker of which materials have been processed.
|
No restrictions when used in beaker.
Make a note on the beaker of which materials have been processed.  
Make a note on the beaker of which materials have been processed.  
|-
|-
|}
|}
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