Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
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== Molybdenum deposition == | == Molybdenum deposition == | ||
Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | ||
==Sputtering of Molybdenum== | |||
Molybdenum may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]]" and "[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]]"). See more in link here and the chart below. | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum/Mo Sputtering in Cluster Lesker PC1|Mo Sputtering in Sputter-System Metal-Oxide(PC1)]] | |||
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! Deposition rate | ! Deposition rate | ||
|1Å/s to 10Å/s | | 1Å/s to 10Å/s | ||
| Depends on process parameters, roughly about 1 Å/s | | Depends on process parameters, roughly about 1 Å/s | ||
| | | At least up to 4 Å/s. See process log. | ||
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