Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
Appearance
| (5 intermediate revisions by 2 users not shown) | |||
| Line 5: | Line 5: | ||
== Molybdenum deposition == | == Molybdenum deposition == | ||
Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | ||
==Sputtering of Molybdenum== | |||
Molybdenum may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]]" and "[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]]"). See more in link here and the chart below. | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum/Mo Sputtering in Cluster Lesker PC1|Mo Sputtering in Sputter-System Metal-Oxide(PC1)]] | |||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
| Line 25: | Line 33: | ||
! Pre-clean | ! Pre-clean | ||
|Ar ion source | |Ar ion source | ||
| | | | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å to | |10Å to 600 nm * | ||
|10Å to 500 Å | |10Å to 500 Å | ||
|10Å to | |10Å to at least 100 nm (discuss with staff) | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
|1Å/s to 10Å/s | | 1Å/s to 10Å/s | ||
| Depends on process parameters, roughly about 1 Å/s | | Depends on process parameters, roughly about 1 Å/s | ||
| | | At least up to 4 Å/s. See process log. | ||
|- | |- | ||
|- | |- | ||
| Line 90: | Line 98: | ||
'''*''' '' | '''*''' ''Please send a request to us if you wish to deposit more than 600 nm (write to metal@nanolab.dtu.dk)'' | ||