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| ==Sputtering of TiW== | | ==Sputtering of TiW== |
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| Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). | | Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). |
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| *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | | *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] |
| *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] | | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] |
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| {| border="1" cellspacing="0" cellpadding="4"
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| |-style="background:silver; color:black"
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| ! Sputter deposition (Wordentec)
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| |-style="background:WhiteSmoke; color:black"
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| ! General description
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| | Sputter deposition of TiW
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| |-
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| |-style="background:LightGrey; color:black"
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| ! Pre-clean
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| |RF Ar clean (not working at the moment (sept 2022))
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| ! Layer thickness
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| |.
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| |-
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| |-style="background:LightGrey; color:black"
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| ! Deposition rate
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| |Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| ! Batch size
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| *24x2" wafers or
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| *6x4" wafers or
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| *6x6" wafers
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| |-
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| |-style="background:LightGrey; color:black"
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| ! Allowed substrates
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| * Silicon wafers
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| * Quartz wafers
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| * Pyrex wafers
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| |-style="background:WhiteSmoke; color:black"
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| !Allowed materials
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| * Silicon oxide
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| * Silicon (oxy)nitride
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| * Photoresist
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| * PMMA
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| * Mylar
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| * SU-8
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| * Metals
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| |-
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| |-style="background:LightGrey; color:black"
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| ! Comments
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| | TiW alloy: 10%/90% by weight
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| |}
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