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Deposition of TiW alloy can take place in the Wordentec.
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{| border="1" cellspacing="0" cellpadding="4"
==Sputtering of TiW==
!
! Sputter deposition (Wordentec)
|-
| Batch size
|
*24x2" wafers or
*6x4" wafers or
*6x6" wafers
|-
| Pre-clean
|RF Ar clean
|-
| Layer thickness
|.
|-
| Deposition rate
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
|}


Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).


'''Deposited rates'''
*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
 
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]
This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings.
 
 
'''Deposited film characteristics'''
 
AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.

Latest revision as of 23:34, 7 July 2025

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Sputtering of TiW

Deposition of TiW alloy was done in the past in the Wordentec. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&oldid=53543"