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| '''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&action=edit click here]''' | | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]''' |
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| | <i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> |
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| Deposition of TiW alloy can take place in the Wordentec.
| | ==Sputtering of TiW== |
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| | Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). |
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| | | *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] |
| '''Observe:''' ''right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.''
| | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] |
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| {| border="1" cellspacing="0" cellpadding="4"
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| |-style="background:silver; color:black"
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| ! Sputter deposition (Wordentec)
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| |-style="background:WhiteSmoke; color:black"
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| ! Batch size
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| *24x2" wafers or
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| *6x4" wafers or
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| *6x6" wafers
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| |-style="background:LightGrey; color:black"
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| ! Pre-clean
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| |RF Ar clean
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| |-style="background:WhiteSmoke; color:black"
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| ! Layer thickness
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| |.
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| |-style="background:LightGrey; color:black"
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| ! Allowed substrates
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| * Silicon wafers
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| * Quartz wafers
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| * Pyrex wafers
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| |-style="background:WhiteSmoke; color:black"
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| !Allowed materials
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| * Silicon oxide
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| * Silicon (oxy)nitride
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| * Photoresist
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| * PMMA
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| * Mylar
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| * SU-8
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| * Metals | |
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| |-style="background:LightGrey; color:black"
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| ! Deposition rate
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| |Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| ! Comments
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| | TiW alloy: 10%/90% by weight
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| |} | |
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| '''Deposited rates'''
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| This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings.
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| '''Deposited film characteristics'''
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| AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.
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