Specific Process Knowledge/Thin film deposition/Deposition of Germanium: Difference between revisions
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==Resistive Thermal evaporation== | ==Resistive Thermal evaporation== | ||
Current process information on Ge thermal evaporation: | |||
* [[/Thermal Ge evaporation Thermal Evaporator|Resistive thermal evaporation of Ge in Thermal Evaporator - Lesker]] | * [[/Thermal Ge evaporation Thermal Evaporator|Resistive thermal evaporation of Ge in Thermal Evaporator - Lesker]] | ||
Some very instrument specific deposition parameters for a now-decommissioned tool can be found here: [[/Thermal Ge deposition Wordentec|Thermal deposition of Ge in Wordentec]] | |||
==Ge deposition equipment comparison== | ==Ge deposition equipment comparison== | ||
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
|Thermal deposition of Ge | |Thermal deposition of Ge | ||
|E-beam deposition of Ge | |E-beam deposition of Ge | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
|none | |none | ||
|Ar ion etch (only in E-beam evaporator Temescal) | |Ar ion etch (only in E-beam evaporator Temescal) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10 Å to about 2000 Å | |10 Å to about 2000 Å | ||
|few nm to about 1 µm* | |few nm to about 1 µm* | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
|1 Å/s | |1 Å/s | ||
|1 Å/s - 5 Å/s | |1 Å/s - 5 Å/s | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | ! Batch size | ||
| | | | ||
*4x 2" wafers or | *4x 2" wafers or | ||
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! Allowed materials | ! Allowed materials | ||
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Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID= | Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]. | ||
| | | | ||
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet]. | Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet]. | ||