Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions

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-Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
+= Tin Deposition =
+Tin can be deposited by sputtering, thermal evaporation or e-beam evaporation in DTU Nanolab's cleanroom.
-{| border="1" cellspacing="0" cellpadding="4"
+==Sputtering of tin==
+We have sputtered tin in both the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter system (Lesker)]] and the [[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1)]]. In the former we have also tested co-sputtering with Cu. In the latter we have more recent results (2025). The initial films were quite rough. Please contact staff for more information.
+==E-beam evaporation of tin==
+Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025).
+==Thermal evaporation of tin ==
+Sn thermal evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough.
+==Comparison of deposition methods==
+{| border="1" cellspacing="0" cellpadding="3"
+|-style="background:silver; color:black"
 !
-! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
+! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
 |-
-| Batch size
+|-style="background:WhiteSmoke; color:black"
-|
+! General description
-*Up to 1x4" wafers
+| E-beam deposition of Sn (line-of-sight)
-*smaller pieces
+| Thermal deposition of Sn (line-of-sight)
+| Sputter deposition of Sn (some step coverage)
+| Sputter deposition of Sn (pulsed DC, HiPIMS and substrate heating available)
 |-
-| Pre-clean
+|-style="background:LightGrey; color:black"
-|RF Ar clean
+!Pre-clean
+|Ar ion  clean
+|none
+|none
+|RF sputter cleaning
 |-
-| Layer thickness
+|-style="background:WhiteSmoke; color:black"
-|10Å to 1µm
+!Layer thickness
+| discuss with staff
+nm to at least 100 nm
+| discuss with staff
+nm to at least 50 nm
+| discuss with staff
+| discuss with staff
+nm to at least 50 nm
 |-
-| Deposition rate
+|-style="background:LightGrey; color:black"
-|2Å/s to 15Å/s
+! Deposition rate
+| discuss with staff (on the order of 1-5 Å/s)
+| discuss with staff (on the order of 1-5 Å/s)
+| discuss with staff
+| discuss with staff (on the order of 1-2 Å/s)
 |-
+|-style="background:WhiteSmoke; color:black"
+!Pre-clean
+|Ar ion bombardment
+|none
+|none
+|RF sputter cleaning
+|-style="background:LightGrey; color:black"
+! Batch size
+|
+*Up to 4x6" wafers or
+*Up to 3x8" wafers or
+*smaller pieces
+|
+*Up to 1x8" wafer or 1x6" wafer
+*Up to 3x4" wafers
+*smaller pieces
+|
+*1x6" wafers or
+*1x4" wafers or
+*smaller pieces
+|
+*up to 10x6" wafers or
+*up to 10x4" wafers or
+*many smaller pieces
+|-
+|-style="background:WhiteSmoke; color:black"
+!Allowed materials
+|
+* Almost any that does not outgas
+*See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
+|
+* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]
+|
+* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
+|
+*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
+|-style="background:LightGrey; color:black"
+! Comment
+| Resulting films are rough
+| Resulting films are very rough
+| Resulting films are rough
+| Resulting films are rough
 |}