Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025). | Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025). | ||
==Thermal evaporation== | ==Thermal evaporation of tin == | ||
Sn evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough. | Sn thermal evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough. | ||
==Comparison of deposition methods== | ==Comparison of deposition methods== | ||
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*Up to 4x6" wafers or | *Up to 4x6" wafers or | ||
*Up to 3x8" wafers | *Up to 3x8" wafers or | ||
*smaller pieces | *smaller pieces | ||
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* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404] | * Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet] | ||
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