Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions

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-'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin&action=edit click here]'''
+= Tin Deposition =
-== Tin deposition ==
+Tin can be deposited by sputtering, thermal evaporation or e-beam evaporation in DTU Nanolab's cleanroom.
-Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in the Physimeca or the Temescal, which we have now (August 2018)
+==Sputtering of tin==
+We have sputtered tin in both the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter system (Lesker)]] and the [[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1)]]. In the former we have also tested co-sputtering with Cu. In the latter we have more recent results (2025). The initial films were quite rough. Please contact staff for more information.
+==E-beam evaporation of tin==
+Sn was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has only been tested once in the [[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] which is currently in the lab. The test resulted in a rather uneven film (more resembling islands of Sn than a continuous layer) and since results with sputtering were more promising we did not fully develop the recipe (spring 2025).
+==Thermal evaporation of tin ==
+Sn thermal evaporation has been tested in early 2025. The required power varied quite a lot from run to run so we do not have a fully automated reliable process. The resulting films were very rough.
+==Comparison of deposition methods==
 {| border="1" cellspacing="0" cellpadding="3"
 |-style="background:silver; color:black"
 !
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
+! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
 |-
 |-style="background:WhiteSmoke; color:black"
 ! General description
-| E-beam deposition of Sn
+| E-beam deposition of Sn (line-of-sight)
-(line-of-sight deposition)
+| Thermal deposition of Sn (line-of-sight)
+| Sputter deposition of Sn (some step coverage)
+| Sputter deposition of Sn (pulsed DC, HiPIMS and substrate heating available)
 |-
 |-style="background:LightGrey; color:black"
 !Pre-clean
 |Ar ion  clean
+|none
+|none
+|RF sputter cleaning
 |-
 |-style="background:WhiteSmoke; color:black"
 !Layer thickness
-|10Å to 1µm*
+| discuss with staff
+nm to at least 100 nm
+| discuss with staff
+nm to at least 50 nm
+| discuss with staff
+| discuss with staff
+nm to at least 50 nm
 |-
 |-style="background:LightGrey; color:black"
 ! Deposition rate
-|1Å/s to 10Å/s
+| discuss with staff (on the order of 1-5 Å/s)
+| discuss with staff (on the order of 1-5 Å/s)
+| discuss with staff
+| discuss with staff (on the order of 1-2 Å/s)
 |-
 |-style="background:WhiteSmoke; color:black"
 !Pre-clean
 |Ar ion bombardment
+|none
+|none
+|RF sputter cleaning
 |-style="background:LightGrey; color:black"
 ! Batch size
 |
-*Up to 4x6" wafers
+*Up to 4x6" wafers or
-*Up to 3x8" wafers (ask for holder)
+*Up to 3x8" wafers or
-*small pieces
+*smaller pieces
+|
+*Up to 1x8" wafer or 1x6" wafer
+*Up to 3x4" wafers
+*smaller pieces
+|
+*1x6" wafers or
+*1x4" wafers or
+*smaller pieces
+|
+*up to 10x6" wafers or
+*up to 10x4" wafers or
+*many smaller pieces
 |-
 |-style="background:WhiteSmoke; color:black"
 !Allowed materials
+|
+* Almost any that does not outgas
+*See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
 |
-* Silicon
+* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]
-*Silicon oxide
-*Silicon (oxy)nitride
+|
-*Photoresist
+* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
-*PMMA
+|
-*Mylar
+*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
-*Metals
-*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
 |-style="background:LightGrey; color:black"
 ! Comment
-| Tin has not yet been deposited in the Temescal to date (August 2018).
+| Resulting films are rough
-Please contact the Thin Film group if you would like us to develop the process.
+| Resulting films are very rough
+| Resulting films are rough
+| Resulting films are rough
 |}
-'''*''' ''For thicknesses above 600 nm permission is required.''