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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel click here]'''
'''All links to Labmanager Including APV and QC requires login.'''




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Some process information is available here for e-beam evaporated films:
Some process information is available here for e-beam evaporated films:
<!--*[[/Electroplating of nickel|Electroplating of nickel]]-->
<!--*[[/Electroplating of nickel|Electroplating of nickel]]-->
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].
*[[/Stress Wordentec Ni films|Stress in e-beam evaporated Ni films: study here]] ''(from the now decommissioned Wordentec deposition tool - basic trends in results should be transferable to other e-beam evaporators).''


In the chart below you can compare the different deposition equipment:
In the chart below you can compare the different deposition equipment:
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!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
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! General description
! General description
|E-beam deposition of Nickel
|E-beam deposition of Nickel
|E-beam deposition of Nickel
|Sputter deposition of Nickel
|Sputter deposition of Nickel
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|Ar ion etch (only in E-beam evaporator Temescal)
|Ar ion etch (only in E-beam evaporator Temescal)
|
|
|RF Ar clean
|RF Ar clean
|RF Ar clean
|-
|-
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! Layer thickness
! Layer thickness
|10 Å to 1 µm *
|10 Å to 1 µm *
|10 Å to 1 µm *
|10 Å to 500 nm **
|10 Å to 5000 Å **
|10 Å to 500 nm **
|10 Å to 5000 Å **
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"


! Deposition rate
! Deposition rate
|1-10 Å/s
|1-10 Å/s
|1-10 Å/s
|Depends on process parameters, about 1 Å/s  
|Depends on process parameters, about 1 Å/s  
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*Up to 3x8" wafers (ask for holder)
*Up to 3x8" wafers (ask for holder)
*Many smaller pieces
*Many smaller pieces
|
*24x2" wafers or
*6x4" wafers or
*6x6" wafers
|
|
* Pieces or
* Pieces or
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|
|
*Almost any that does not degas at your intended substrate temperature. See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*Almost any that does not degas at your intended substrate temperature. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
* Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
|
|
* Almost any that do not degas.
*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
|
*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]


|-
|-
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! Comment
! Comment
|
|
|
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].
|
|
*May use high-strength magnet for deposition.  
*May use high-strength magnet for deposition.  
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==Quality control of e-beam evaporated Ni films==
==Quality control of e-beam evaporated Ni films==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality control (QC) for Wordentec'''
|bgcolor="#98FB98" |'''Quality control (QC) for the E-beam Evaporator (Temescal) and the E-beam Evaporator (10-pockets)'''
|-
|-
|
|
Nickel deposition is tested occasionally, around 1-2 times per year. LabManager links require login.
Nickel deposition is tested occasionally, around 1 time per year in each machine. You are welcome to contact staff to request an extra test of the material.  
*[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec in LabManager]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec in LabManager]<br>


{| {{table}}
'''LabManager links to procedures and data''' (require login):
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"


! QC Recipe:
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the E-beam Evaporator (Temescal)]<br>
! Process 5
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the E-beam Evaporator (Temescal)]<br>
|-
|Deposition rate
|10 Å/s
|-
|Thickness
|100 nm
|-
|Pressure
|Below 4*10<sup>-6</sup> mbar
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"
!QC limits
!Wordentec
|-
|Measured average thickness (Å)
|± 10 %
|-
|Lowest accepted deposition rate (Å/s)
|6 Å/s
|-
|}
|-
|}
Thickness is measured in 5 points with a stylus profiler.
|}


*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=511 QC procedure for the E-beam Evaporator (10-pockets)]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=511 The newest QC data for the E-beam Evaporator (10-pockets)]<br>


{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality control (QC) for the Temescal'''
|-
|
Nickel deposition is tested occasionally, around 1 time per year. LabManager links require login.
*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal in LabManager]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal in LabManager]<br>


{| {{table}}
{| {{table}}
| align="center" |  
| align="left" valign="top"|
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"
{| border="2" cellspacing="1" cellpadding="2" align="left" style="width:400px"
 
! QC Recipe:
! QC Recipe:
! Standard recipes/Ni  
! Standard recipes/Ni  
|-  
|-  
|Deposition rate
|Deposition rate
|10 Å/s
|2 Å/s
|-
|-
|Thickness
|Thickness
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|-
|-
|}
|}
| align="center" valign="top"|
|-
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"
|}
 
 
{| {{table}}
| align="left" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="left" style="width:400px"
!QC limits
!QC limits
!Temescal
!Both E-beam Evaporators
|-
|-
|Deposition rate deviation
|Deposition rate deviation
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|-
|-
|}
|}
Thickness is measured in 5 points with a stylus profiler. <br>
 
Thickness is measured in 5 points with a stylus profiler (usually DektakXT). <br>
|}
|}
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