Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions

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-'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
+===Palladium deposition===
+Palladium can be deposited by e-beam evaporation or DC sputtering at DTU Nanolab.
-Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
+==Sputtering of Palladium==
+Palladium may be sputter deposited in the sputter-system (Lesker). See process results here:
+*[[/Pd sputtering in Sputter System (Lesker) |Pd sputtering in Sputter System (Lesker)]]
+==Equipment comparison==
+In the chart below you can compare the different deposition equipment:
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 !
-! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+| E-beam deposition of Pd
-*Up to 1x4" wafers
+| Sputter deposition of Pd
-*smaller pieces
+| Sputter deposition of Pd
 |-
 |-style="background:Lightgrey; color:black"
 ! Pre-clean
+|Ar ion source (only in E-beam Evaporator Temescal)
+|none
 |RF Ar clean
 |-
 |-style="background:WhiteSmoke; color:black"
 ! Layer thickness
-|10Å to 1µm
+|10 Å - 600 nm*
+|10 Å - 600 nm*
+|Discuss with staff
 |-
 |-style="background:Lightgrey; color:black"
 ! Deposition rate
-|2Å/s to 10Å/s
+|0.5 Å/s to 10Å/s
+|Up to 4.3 Å/s
+| Discuss with staff
 |-
 |-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 4x6" wafers
+*Up to 3x8" wafers
+*smaller wafers and pieces
+|
+*1x4" wafer or
+*1x6" wafer or
+*several small samples
+|
+*Up to 10x4" or 6" wafers
+*Many smaller pieces
+|-
+|-style="background:Lightgrey; color:black"
 !Allowed materials
 |
-* Silicon oxide
+*Almost any that does not degas
-* Silicon (oxy)nitride
+*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
-* Photoresist
+|
-* PMMA
+*Almost any that does not degas.
-* Mylar
+*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
-* SU-8
+| Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
-* Metals
-|-style="background:Lightgrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comment
+|
+|
 |
 |}
+'''*''' ''If depositing more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.''