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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD click here]'''
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== XRD SmartLab ==
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.


[[image:XRD_SmartLab.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
=XRD at DTU Nanolab=
We have three X-ray diffraction setups in building 346:
*The [[/XRD_SmartLab|XRD SmartLab]] primarily for thin film analysis inside the cleanroom.
*The [[/XRD SmartLab 9kW Rotating Anode|XRD SmartLab 9kW Rotating Anode]] multipurpose system outside the cleanroom.
*The [[/XRD_Powder|XRD Powder]] for phase analysis of powders outside the cleanroom.


==Experiments performed with XRD==
*[[/Process Info|List and description of possible XRD measurements with typical setup requirements]] Note mostly relevant for XRD Smartlab and XRD Rot Anode


'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''
==Data analysis==
For data analysis, we recommend using Rigaku SmartLab Studio for both thinfilms and basic powder analysis.
If more advanced powder analysis is needed we provide access to a remote desktop with a licence for the excellent Malvern Panalytical software, HighScore.


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=428  XRD SmartLab in LabManager]
*[[/software|Installing SmartLab Studio II]]
*[[/dataconversion|Converting data from XRD Powder to SmartLab Studio II]]
*[[/SLSII_analysis|Guide for using SmartLab Studio II for data analysis]]
*[[/HighScore_analysis|Guide for using HighScore Plus for advanced powder data analysis]]
*[[/XRD_Reference_Data|How to download reference spectra for individual crystal structures]] (for DTU users and others with access to the ICSD).


== Process information ==
Apart from commercial software a wide range of free software is available online for data analysis. Please let us know if you find something you'd like to recommend!


<!--*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]-->
==Comparison of the XRDs at Nanolab==
 
==Software for analysis==
The software packages used for data analysis are available on the equipment computer, but we recommend that you install it on your personal computer. To run the software you need a USB dongle with a license on, these can be borrowed from Rebecca and Kristian in room 347-077. We only have 9 dongles available, so when you are done please return the dongle to danchip.
 
The software can be found on "CleanroomDrive\_Equipment\XRD\Rigaku software\RILauncher", it should be possible to install the software without a dongle. To use the software you have to log in. The user is: Administrator. There is no password.
 
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
Line 28: Line 31:
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>XRD SmartLab</b>
|style="background:WhiteSmoke; color:black"|<b>XRD SmartLab</b>
|style="background:WhiteSmoke; color:black"|<b>XRD RotAnode</b>
|style="background:WhiteSmoke; color:black"|<b>XRD Powder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"| Crystal structure analysis and thin film thickness measurement
|style="background:LightGrey; color:black"| Crystal structure analysis  
 
and thin film thickness measurement
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Phase ID
Line 37: Line 44:
*Quality and degree of orientation
*Quality and degree of orientation
*3D orientation
*3D orientation
*Latice strain
*Lattice strain
*Composition
*Composition
*Twist
*Twist
Line 44: Line 51:
*Roughness
*Roughness
*Density
*Density
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Crystal Size
*Crystallinity
*Quality and degree of orientation
*3D orientation
*Lattice strain
*Composition
*Twist
*3D lattice constant
*Thickness
*Roughness
*Density
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Crystal Size
*Crystallinity
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|X-ray generator
!style="background:silver; color:black" align="center" valign="center" rowspan="6"|X-ray generator
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Maximum rated output
Maximum rated output
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
3 kW
3 kW
|style="background:WhiteSmoke; color:black"|
9 kW
|style="background:WhiteSmoke; color:black"|
600 W
|-
|-
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Line 55: Line 83:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
20 to 45 kV
20 to 45 kV
|style="background:WhiteSmoke; color:black"|
20 to 45 kV
|style="background:WhiteSmoke; color:black"|
40 kV
|-
|-
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Line 60: Line 92:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
2 to 60 mA
2 to 60 mA
|style="background:WhiteSmoke; color:black"|
2 to 200 mA
|style="background:WhiteSmoke; color:black"|
15 mA
|-
|-
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Type
Type
|style="background:WhiteSmoke; color:black"|
Sealed tube
|style="background:WhiteSmoke; color:black"|
Rotating Anode
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Sealed tube
Sealed tube
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|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Target
Target
|style="background:WhiteSmoke; color:black"|
Cu
|style="background:WhiteSmoke; color:black"|
Cu
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Cu
Cu
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Focus size
Focus size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.4x8 mm (Line/Point)
0.4 mm x 8 mm (Line/Point)
|style="background:WhiteSmoke; color:black"|
0.1-0.5 mm x 8 mm (Line/Point)
|style="background:WhiteSmoke; color:black"|
0.4 mm x 12 mm (Line)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer
|style="background:LightGrey; color:black"|Parameter 1
|style="background:LightGrey; color:black"|
Scanning mode
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
incident / receiver coupled or independent
|style="background:WhiteSmoke; color:black"|
incident / receiver coupled or independent
|style="background:WhiteSmoke; color:black"|
incident / receiver coupled
|-
|style="background:LightGrey; color:black"|
Goniomenter radius
|style="background:WhiteSmoke; color:black"|
300 mm
|style="background:WhiteSmoke; color:black"|
300 mm
|style="background:WhiteSmoke; color:black"|
145 mm
|-
|style="background:LightGrey; color:black"|
Minimum step size
|style="background:WhiteSmoke; color:black"|
0.0001° (0.36")
|style="background:WhiteSmoke; color:black"|
0.0001° (0.36")
|style="background:WhiteSmoke; color:black"|
0.001° (3.6")
|-
|style="background:LightGrey; color:black"|
Sample stage motion
|style="background:WhiteSmoke; color:black"|
*&chi;:-5~+95°
*&phi;:0~360°
*Z:-4~+1 mm
*X,Y:&plusmn;50 mm for a 100 mm wafer
*Rx,Ry:-5~+5°
|style="background:WhiteSmoke; color:black"|
*&chi;:-5~+95°
*&phi;:0~360°
*Z:-4~+1 mm
*X,Y:&plusmn;50 mm for a 100 mm wafer
*Rx,Ry:-5~+5°
|style="background:WhiteSmoke; color:black"|
Fixed with rotation
 
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
|style="background:LightGrey; color:black"|Incident side
|style="background:WhiteSmoke; color:black"|
*Cross Beam Optics(CBO)
*Ge(220)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Automatic variable divergence slit
*Length limiting slits
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*Cross Beam Optics(CBO)
*Ge(400)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Automatic variable divergence slit
*Length limiting slits
|style="background:WhiteSmoke; color:black"|
*0.04° soller slit
*Ni and Cu filter
*Divergence slits
*Beam masks
|-
|style="background:LightGrey; color:black"|Receiver side
|style="background:WhiteSmoke; color:black"|
*Automatic variable scattering slit
*Automatic variable receiver slit
*Parallel slit analysers (PSA)
*Ge(220)x2 analyser
|style="background:WhiteSmoke; color:black"|
*Automatic variable scattering slit
*Automatic variable receiver slit
*Parallel slit analysers (PSA)
*Ge(400)x2 analyser
|style="background:WhiteSmoke; color:black"|
*0.04° soller slit
*Ni filter
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Measurement temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
May be heated in N<sub><sub>2</sub></sub> up to 500°C
|-
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
up to 150 mm wafers
up to 150 mm wafers
Thickness max 21 mm
|style="background:WhiteSmoke; color:black"|
up to 150 mm wafers
Thickness max 21 mm
|style="background:WhiteSmoke; color:black"|
Only for powders
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
All materials
All materials approved in the cleanroom.
 
No powders or dusty materials.
|style="background:WhiteSmoke; color:black"|
All materials have to be approved
|style="background:WhiteSmoke; color:black"|
All materials have to be approved
|-  
|-  
|}
|}


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