Jump to content

Specific Process Knowledge/Characterization/XRD: Difference between revisions

← Older edit
VisualWikitext
Khara (talk | contribs)
DCH-Employees-701, NLAB-LabmanagerAllUsers
277 edits
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,736 edits
 
(89 intermediate revisions by 4 users not shown)
Line 1: Line 1:
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD click here]'''
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->


== XRD SmartLab ==
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
=XRD at DTU Nanolab=
We have three X-ray diffraction setups in building 346:
*The [[/XRD_SmartLab|XRD SmartLab]] primarily for thin film analysis inside the cleanroom.
*The [[/XRD SmartLab 9kW Rotating Anode|XRD SmartLab 9kW Rotating Anode]] multipurpose system outside the cleanroom.
*The [[/XRD_Powder|XRD Powder]] for phase analysis of powders outside the cleanroom.


==Experiments performed with XRD==
*[[/Process Info|List and description of possible XRD measurements with typical setup requirements]] Note mostly relevant for XRD Smartlab and XRD Rot Anode


'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''
==Data analysis==
For data analysis, we recommend using Rigaku SmartLab Studio for both thinfilms and basic powder analysis.
If more advanced powder analysis is needed we provide access to a remote desktop with a licence for the excellent Malvern Panalytical software, HighScore.


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=428  RIE1 in LabManager]
*[[/software|Installing SmartLab Studio II]]
*[[/dataconversion|Converting data from XRD Powder to SmartLab Studio II]]
*[[/SLSII_analysis|Guide for using SmartLab Studio II for data analysis]]
*[[/HighScore_analysis|Guide for using HighScore Plus for advanced powder data analysis]]
*[[/XRD_Reference_Data|How to download reference spectra for individual crystal structures]] (for DTU users and others with access to the ICSD).


== Process information ==
Apart from commercial software a wide range of free software is available online for data analysis. Please let us know if you find something you'd like to recommend!


Link to process pages - e.g. one page for each material
==Comparison of the XRDs at Nanolab==
 
Example:
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
 
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
|style="background:WhiteSmoke; color:black"|<b>XRD SmartLab</b>
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
|style="background:WhiteSmoke; color:black"|<b>XRD RotAnode</b>
|style="background:WhiteSmoke; color:black"|<b>XRD Powder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"| Crystal structure analysis
 
and thin film thickness measurement
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Crystal Size
*Crystallinity
*Quality and degree of orientation
*3D orientation
*Lattice strain
*Composition
*Twist
*3D lattice constant
*Thickness
*Roughness
*Density
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Crystal Size
*Crystallinity
*Quality and degree of orientation
*3D orientation
*Lattice strain
*Composition
*Twist
*3D lattice constant
*Thickness
*Roughness
*Density
|style="background:WhiteSmoke; color:black"|
*Phase ID
*Crystal Size
*Crystallinity
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="6"|X-ray generator
|style="background:LightGrey; color:black"|
Maximum rated output
|style="background:WhiteSmoke; color:black"|
3 kW
|style="background:WhiteSmoke; color:black"|
9 kW
|style="background:WhiteSmoke; color:black"|
600 W
|-
|style="background:LightGrey; color:black"|
Rated tube voltage
|style="background:WhiteSmoke; color:black"|
20 to 45 kV
|style="background:WhiteSmoke; color:black"|
20 to 45 kV
|style="background:WhiteSmoke; color:black"|
40 kV
|-
|style="background:LightGrey; color:black"|
Rated tube current
|style="background:WhiteSmoke; color:black"|
2 to 60 mA
|style="background:WhiteSmoke; color:black"|
2 to 200 mA
|style="background:WhiteSmoke; color:black"|
15 mA
|-
|style="background:LightGrey; color:black"|
Type
|style="background:WhiteSmoke; color:black"|
Sealed tube
|style="background:WhiteSmoke; color:black"|
Rotating Anode
|style="background:WhiteSmoke; color:black"|
Sealed tube
|-
|style="background:LightGrey; color:black"|
Target
|style="background:WhiteSmoke; color:black"|
Cu
|style="background:WhiteSmoke; color:black"|
Cu
|style="background:WhiteSmoke; color:black"|
Cu
|-
|style="background:LightGrey; color:black"|
Focus size
|style="background:WhiteSmoke; color:black"|
0.4 mm x 8 mm (Line/Point)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
0.1-0.5 mm x 8 mm (Line/Point)
*Purpose 2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
0.4 mm x 12 mm (Line)
*Purpose 2
*Purpose 3
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer
|style="background:LightGrey; color:black"|Response 1
|style="background:LightGrey; color:black"|
Scanning mode
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range 1
incident / receiver coupled or independent
*Performance range 2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range 1
incident / receiver coupled or independent
*Performance range 2
|style="background:WhiteSmoke; color:black"|
*Performance range 3
incident / receiver coupled
|-
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:LightGrey; color:black"|
Goniomenter radius
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range
300 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Performance range
300 mm
|style="background:WhiteSmoke; color:black"|
145 mm
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|Parameter 1
Minimum step size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
0.0001° (0.36")
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
0.0001° (0.36")
|style="background:WhiteSmoke; color:black"|
0.001° (3.6")
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|
Sample stage motion
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*&chi;:-5~+95°
*&phi;:0~360°
*Z:-4~+1 mm
*X,Y:&plusmn;50 mm for a 100 mm wafer
*Rx,Ry:-5~+5°
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*&chi;:-5~+95°
*&phi;:0~360°
*Z:-4~+1 mm
*X,Y:&plusmn;50 mm for a 100 mm wafer
*Rx,Ry:-5~+5°
|style="background:WhiteSmoke; color:black"|
Fixed with rotation
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
|style="background:LightGrey; color:black"|Incident side
|style="background:WhiteSmoke; color:black"|
*Cross Beam Optics(CBO)
*Ge(220)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Automatic variable divergence slit
*Length limiting slits
|style="background:WhiteSmoke; color:black"|
*Cross Beam Optics(CBO)
*Ge(400)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Automatic variable divergence slit
*Length limiting slits
|style="background:WhiteSmoke; color:black"|
*0.04° soller slit
*Ni and Cu filter
*Divergence slits
*Beam masks
|-
|style="background:LightGrey; color:black"|Receiver side
|style="background:WhiteSmoke; color:black"|
*Automatic variable scattering slit
*Automatic variable receiver slit
*Parallel slit analysers (PSA)
*Ge(220)x2 analyser
|style="background:WhiteSmoke; color:black"|
*Automatic variable scattering slit
*Automatic variable receiver slit
*Parallel slit analysers (PSA)
*Ge(400)x2 analyser
|style="background:WhiteSmoke; color:black"|
*0.04° soller slit
*Ni filter
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Measurement temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
May be heated in N<sub><sub>2</sub></sub> up to 500°C
|-
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
up to 150 mm wafers
 
Thickness max 21 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
up to 150 mm wafers
*<nowiki>#</nowiki> 50 mm wafers
 
*<nowiki>#</nowiki> 100 mm wafers
Thickness max 21 mm
*<nowiki>#</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
Only for powders
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
All materials approved in the cleanroom.
*Allowed material 2
 
No powders or dusty materials.
|style="background:WhiteSmoke; color:black"|
All materials have to be approved
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
All materials have to be approved
*Allowed material 2
*Allowed material 3
|-  
|-  
|}
|}


<br clear="all" />
<br clear="all" />
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/XRD"