Specific Process Knowledge/Process Flow: Difference between revisions
mNo edit summary |
|||
| (2 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
[[Category:346]] | |||
=The Process Flow= | =The Process Flow= | ||
A Process Flow contains the sequence of steps and techniques used to create certain structures and devices at the microscopic and nanoscopic scales. This involves a combination of various fabrication methods and inspection techniques to achieve the desired features and functionalities. | A Process Flow contains the sequence of steps and techniques used to create certain structures and devices at the microscopic and nanoscopic scales. This involves a combination of various fabrication methods and inspection techniques to achieve the desired features and functionalities. | ||
| Line 92: | Line 88: | ||
| width="150" align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]] | | width="150" align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]] | ||
| width="150" align="center" style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]] | | width="150" align="center" style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]] | ||
| width="150" align="center" style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link= | | width="150" align="center" style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link=LabAdviser/Process Flow/Solar cell process flow|We have made the process flow for a simple solar cell available. It shows you how to build up a process flow for a component that can be made at DTU Nanolab.]] | ||
|- | |- | ||
|} | |} | ||