Specific Process Knowledge/Process Flow: Difference between revisions
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=The Process Flow= | =The Process Flow= | ||
A Process Flow contains the sequence of steps and techniques used to create certain structures and devices at the microscopic and nanoscopic scales. This involves a combination of various fabrication methods and inspection techniques to achieve the desired features and functionalities. | A Process Flow contains the sequence of steps and techniques used to create certain structures and devices at the microscopic and nanoscopic scales. This involves a combination of various fabrication methods and inspection techniques to achieve the desired features and functionalities. | ||
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Process flow example: [[LabAdviser/Process Flow/Solar cell process flow|Solar Cell Process flow]] | Process flow example: [[LabAdviser/Process Flow/Solar cell process flow|Solar Cell Process flow]] | ||
<br>In the following | <br>In the following sections, you can find some guidelines and relevant information for creating your own process flow, such as relevant information about substrate, pattern design and mask fabrication, as well as process steps and characterization methods. | ||
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| width="150" align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]] | | width="150" align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]] | ||
| width="150" align="center" style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]] | | width="150" align="center" style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]] | ||
| width="150" align="center" style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link= | | width="150" align="center" style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link=LabAdviser/Process Flow/Solar cell process flow|We have made the process flow for a simple solar cell available. It shows you how to build up a process flow for a component that can be made at DTU Nanolab.]] | ||
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== Characterization == | == Characterization == | ||
A crucial and often neglected part of each process flow is the characterization. After critical process steps you might need to analyze and measure the properties of produced structures, layers, materials or entire devices. Characterization techniques help you ensure that the fabricated components meet the required specifications and function correctly. There are many tools and methods available to inspect, analyze and measure the properties of features and materials such as physical, chemical, electrical, and mechanical properties. | A crucial and often neglected part of each process flow is the characterization. After critical process steps you might need to analyze and measure the properties of produced structures, layers, materials or entire devices. Characterization techniques help you ensure that the fabricated components meet the required specifications and function correctly. There are many tools and methods available to inspect, analyze and measure the properties of features and materials such as physical, chemical, electrical, and mechanical properties. | ||
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Below we will try to sum up some of the more typical characterization methods, but for now, please have a look at the [[Specific Process Knowledge/Characterization | '''Characterization''']] page. | |||
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=== Surface Toppography === | === Surface Toppography === | ||
''Analysis of form, shape, size, structure, and surface features including surface roughness, f.ex'' | ''Analysis of form, shape, size, structure, and surface features including surface roughness, f.ex'' | ||
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== Special Requirements == | == Special Requirements == | ||